TVS Diode Datasheet
SMF4L Series
Surface Mount – 400W
ꢀꢁꢂS Pb e3
Description
Uni-directional
The SMF4L series of SOD-123FL small and flat lead low-profile
plastic package is designed specifically to protect sensitive
electronic equipment from voltage transients induced by lightning
and other transient voltage events.
Features & Benefits
■ 400W peak pulsepower
capability at 10/1000µs
waveform, repetition rate
(duty cycle): 0.01%
■ High temperature soldering:
260°C/30 seconds at
terminals
Bi-directional
■ VBR @TJ= VBR@25°C
x (1+αT x (TJ - 25))
■ Compatible with industrial
standard package SOD-123FL
(αT:Temperature Coefficient,
typical value is 0.1%)
■ Low profile: maximum height
of 1mm.
■ Glass passivated junction
■ Built-in strain relief
Additional Information
■ Low inductance, excellent
clamping capability
■ Plastic package is
■ For surface mounted
applications to optimize board
space
flammability rated V-0 per
Underwriters Laboratories
■ Meet MSL level1, per
J-STD-020, LF maximun peak
of 260°C
■ Typical failure mode is short
from over-specified voltage or
current
Resources
Accessories
Samples
■ Matte tin lead–free plated
■ Whisker test is conducted
based on JEDEC JESD201A
per its table 4a and 4c
■ Halogen-free and RoHS
compliant
Agency Approvals
■ Pb-free E3 means 2nd level
interconnect is Pb-free and
the terminal finish material is
tin(Sn) (IPC/JEDEC J-STD-
609A.01)
■ IEC-61000-4-2 ESD 30kV(Air),
30kV (Contact)
Agency
Agency File Number
■ ESD protection of data lines
in accordance with IEC
61000-4-2
E230531
■ Recognized to UL 497B
as an Isolated Loop Circuit
Protector
■ EFT protection of data lines in
accordance with IEC 61000-
4-4
Maximum Ratings andThermal Characteristics
(TA=25OC unless otherwise noted)
■ Fast response time: typically
less than 1.0ns from 0 Volts
to VBR min
Parameter
Symbol
Value
Unit
Peak Pulse Power
Dissipation atTA=25ºC
(Note 1)
8/20μs (Note2)
2000
400
W
W
PPPM
10/1000μs (Note3)
Applications
Power Dissipation On Infinite Heat Sink at
TL=50ºC
PD
1
W
SMF4L devices are ideal for the protection of I/O interfaces, VCC
bus and other vulnerable circuit used in cellular phones, portable
devices, business machines, power supplies and other consumer
applications.
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Lead
RƟJA
RƟJL
220
100
°C/W
°C/W
Operating and StorageTemperature Range TJ,TSTG -55 to 150 °C
Notes:
1. Non-repetitive current pulse, per Fig. 4 and derated above TJ (initial) =25ºC per Fig. 3.
2. SMF4L5.0A~SMF4L8.5A Peak Pulse Power Dissipation is 1850W min, 2000W typical @8/20us
3. SMF4L5.0A~SMF4L8.5A Peak Pulse Power Dissipation is 370W min, 400W typical @ 10/1000μs,
SMF4L90A~SMF4L250A Peak Pulse Power Dissipation is 200W typical @ 10/1000μs
Functional Diagram
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© 2021 Littelfuse, Inc.
Specifications are subject to change without notice.
1
Revised: JC.05/26/21