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SMD26PL-TP-HF PDF预览

SMD26PL-TP-HF

更新时间: 2024-11-12 19:30:07
品牌 Logo 应用领域
美微科 - MCC 光电二极管
页数 文件大小 规格书
3页 400K
描述
Rectifier Diode, Schottky, 1 Phase, 1 Element, 2A, 60V V(RRM), Silicon,

SMD26PL-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.71
应用:GENERAL PURPOSE配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.7 VJESD-30 代码:R-PDSO-F2
湿度敏感等级:1最大非重复峰值正向电流:50 A
元件数量:1相数:1
端子数量:2最高工作温度:125 °C
最低工作温度:-65 °C最大输出电流:2 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
最大功率耗散:1.68 W最大重复峰值反向电压:60 V
最大反向电流:500 µA子类别:Rectifier Diodes
表面贴装:YES技术:SCHOTTKY
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

SMD26PL-TP-HF 数据手册

 浏览型号SMD26PL-TP-HF的Datasheet PDF文件第2页浏览型号SMD26PL-TP-HF的Datasheet PDF文件第3页 
M C C  
SMD22PL  
THRU  
SMD210PL  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
Halogen free available upon request by adding suffix "-HF"  
High-Surge-Capability  
Low Forward Voltage  
ge  
Low Profile Packa  
Schottky Barrier  
Diodes  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
·
·
20 to 100 Volts  
Mechanical Data  
Packaging: SOD-123FL  
Marking Code: SMD22PL---M2;  
SMD24PL---M4; SMD26PL---M6  
SMD210PL---M10;  
SOD-123FL  
SMD28PL---M8;  
Maximum Ratings  
Symbol  
A
B
Parameter  
Rating  
Unit  
Maximum RMS Voltage  
SMD22PL  
SMD24PL  
SMD26PL  
SMD28PL  
SMD210PL  
14  
28  
42  
56  
70  
VRMS  
V
V
C
E
Repetitive Peak Reverse Voltage SMD22PL  
20  
40  
60  
VRRM  
SMD24PL  
SMD26PL  
SMD28PL  
SMD210PL  
80  
100  
H
D
Rectified Current (Average) Half Wave  
Rectification with Resist. Load at TL=90  
OC  
IF(AV)  
IFSM  
2.0  
A
A
Surge Forward Current,halfsine wave 8.3ms  
50  
O
60  
30  
21  
C/W  
C/W  
C/W  
W
G
RthJA  
RthJC  
RthJL  
O
Typical Thermal Resistance(Note2)  
DIMENSIONS  
O
DIM  
INCHES  
MIN  
MM  
NOTE  
1.68  
PD  
Power Dissipation  
MAX  
.152  
.122  
.075  
.053  
.041  
-----  
.010  
MIN  
3.55  
2.55  
1.40  
0.90  
0.50  
0.25  
----  
MAX  
3.85  
3.10  
1.90  
1.35  
1.05  
-----  
.25  
Junction and Storage  
Temperature  
SMD22PL~SMD26PL  
SMD28PL~SMD210PL  
-65 to +125  
-65 to +150  
oC  
A
B
C
D
E
G
H
.140  
.100  
.055  
.035  
.020  
.010  
-----  
TJ, Tstg  
OC  
Electrical Characteristics @ 25OC Unless Otherwise Specified  
Symbol  
VF  
Parameter  
Min  
Typ Max Units  
---  
---  
---  
Forward Voltag  
(@2A dc)  
SMD22PL~24PL  
---  
0.50  
0.70  
0.85  
V
SMD26PL  
---  
---  
SMD28PL~210PL  
---  
---  
---  
IR  
SUGGESTED SOLDER  
PAD LAYOUT  
mA  
pF  
Maximum DC Reverse Current  
0.5  
---  
0.093”  
C
j
Typical--Junction--Capacitance  
@f=1.0MHz,Vr=4V  
210  
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.  
0.048”  
2. Thermal Resistance:PC Board Mounted on 0.2*0.2''(5*5mm) copper pad area.  
0.036”  
www.mccsemi.com  
1 of 3  
Revision: D  
2014/04/18  

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