TVS Diodes
Surface Mount – 1500W > SMCJ series
Pb e3
RoꢀS
SMCJ Series
Description
The SMCJ series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Uni-directional
Features
Bi-directional
• 1500W peak pulse power • Fast response time:
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Excellent clamping
capability
typically less than 1.0ps
from 0V to BV min
• Glass passivated chip
junction
• High temperature to reflow
soldering guaranteed:
260°C/30sec
Agency Approvals
Agency
• Low incremental surge
resistance
Agency File Number
•Typical IR less than 1μA
when VBR min>12V
• For surface mounted
applications to optimize
board space
• Low profile package
• Built-in strain relief
•Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC 61000-4-2 ESD
30kV(Air), 30kV (Contact)
• VBR @TJ= VBR@25°C
x (1+αT x (TJ - 25))
(αT:Temperature
Coefficient, typical value is
0.1%)
• Plastic package is
flammability rated V-0 per
Underwriters Laboratories
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is Pb-
free and the terminal finish
material is tin(Sn) (IPC/
JEDEC J-STD-609A.01)
E230531
Maximum Ratings andThermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol Value
Unit
Peak Pulse Power Dissipation(Fig.2)
by 10/1000usTest Waveform(Fig.4) (Note 1),(Note
2)-Single Die Parts
Peak Pulse Power Dissipation(Fig.2)
by 10/1000usTest Waveform(Fig.4) (Note 1), (Note
2)-Stacked Die Parts (Note 5)
PPPM
1500
2000
W
PPPM
W
Power Dissipation on Infinite Heat Sink atTL=50OC
PD
6.5
W
A
Peak Forward Surge Current, 8.3ms Single Half
Sine Wave (Note 3)
IFSM
200
Maximum Instantaneous Forward Voltage at 100A
for Unidirectional Only (Note 4)
VF
TJ
3.5/5.0
V
• ESD protection of data
lines in accordance with
IEC 61000-4-2
OperatingTemperature Range
-65 to 150 °C
StorageTemperature Range
TSTG -65 to 175 °C
• EFT protection of data
lines in accordance with
IEC 61000-4-4
TypicalThermal Resistance Junction to Lead
TypicalThermal Resistance Junction to Ambient
15
75
°C/W
°C/W
Rθ
Rθ
JL
JA
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty
Applications
cycle=4 per minute maximum.
4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts.
5. For stacked die component details, please refer to part numbers labeled by * in Electrical Characteristics.
TVS devices are ideal for the protection of I/O Interfaces,
CC bus and other vulnerable circuits used inTelecom,
V
Computer, Industrial and Consumer electronic applications.
Functional Diagram
Additional Infomarion
Bi-directional
Dꢀꢁꢀsꢂeeꢁ
Sꢀꢁꢂꢃes
ꢀesoꢁꢂꢃes
Cathode
Anode
Uni-directional
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: JC.10/29/20