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SMCJ11CAE3TR PDF预览

SMCJ11CAE3TR

更新时间: 2024-11-13 19:06:35
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管电视
页数 文件大小 规格书
4页 198K
描述
1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMCJ, 2 PIN

SMCJ11CAE3TR 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:DO-214AB
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.09
Is Samacsys:N最大击穿电压:13.5 V
最小击穿电压:12.2 V击穿电压标称值:12.85 V
最大钳位电压:18.2 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214ABJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
最大非重复峰值反向功率耗散:1500 W元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-65 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:BIDIRECTIONAL
最大功率耗散:1.56 W最大重复峰值反向电压:11 V
子类别:Transient Suppressors表面贴装:YES
技术:AVALANCHE端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

SMCJ11CAE3TR 数据手册

 浏览型号SMCJ11CAE3TR的Datasheet PDF文件第2页浏览型号SMCJ11CAE3TR的Datasheet PDF文件第3页浏览型号SMCJ11CAE3TR的Datasheet PDF文件第4页 
SMCJ5.0 thru SMCJ170CA, e3  
and SMCG5.0 thru SMCG170CA, e3  
SURFACE MOUNT 1500 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The SMCJ5.0-170A or SMCG5.0-170A series of 1500 W Transient Voltage  
Suppressors (TVSs) protects a variety of voltage-sensitive components. It is  
available in J-bend design (SMCJ) with the DO-214AB package for greater PC  
board mounting density or in a Gull-wing design (SMCG) in the DO-215AB for  
visible solder connections. Selections include unidirectional and bidirectional  
as well as RoHS Compliant with an e3 suffix. They can protect from secondary  
lightning effects per IEC61000-4-5 and class levels defined herein, or for  
inductive switching environments and induced RF protection. Since their  
response time is virtually instantaneous, they can also be used in protection  
from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.  
NOTE: All SMC series are  
equivalent to prior SMM package  
identifications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Economical surface mount design in both J-bend or  
Gull-wing terminations  
Selections for 5.0 to 170 volts standoff voltages (VWM  
)
Protection from switching transients and induced RF  
Available in both Unidirectional and Bidirectional  
construction with a C or CA suffix  
Protection from ESD, and EFT per IEC 61000-4-2 and  
IEC 61000-4-4  
Optional 100% screening for avionics grade is  
available by adding MA prefix to part number for added  
100% temperature cycle -55oC to +125oC (10X) as well  
as surge (3X) and 24 hours HTRB with post test VBR  
ID (in the operating direction for unidirectional or both  
directions for bidirectional)  
Secondary lightning protection per IEC61000-4-5 with  
42 Ohms source impedance:  
Class 1: SMC 5.0 to SMC 170A or CA  
Class 2: SMC 5.0 to SMC 150A or CA  
Class 3: SMC 5.0 to SMC 75A or CA  
Class 4: SMC 5.0 to SMC 36A or CA  
&
Options for screening in accordance with MIL-PRF-  
19500 for JANTX by adding MX prefix to the part  
number.  
Secondary lightning protection per IEC61000-4-5 with  
12 Ohms source impedance:  
Class 1 : SMC 5.0 to SMC 90A or CA  
Class 2: SMC 5.0 to SMC 45A or CA  
Class 3: SMC 5.0 to SMC 24A or CA  
Class 4: SMC 5.0 to SMC 11A or CA  
Axial-lead equivalent packages for thru-hole mounting  
available as 1.5KE6.8 to 1.5KE200CA or 1N6267 thru  
1N6303A and 1N5908 (consult factory for other  
surface mount options)  
Moisture classification is Level 1 with no dry pack  
required per IPC/JEDEC J-STD-020B  
Secondary lightning protection per IEC61000-4-5 with  
2 Ohms source impedance:  
Class 2: SMC 5.0 to SMC 22A or CA  
Class 3: SMC 5.0 to SMC 10A or CA  
RoHS compliant devices available by adding “e3” suffix  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Peak Pulse Power dissipation at 25ºC: 1500 watts at  
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
10/1000 μs (also see Fig 1,2, and 3)  
Impulse repetition rate (duty factor): 0.01%  
TERMINALS: Gull-wing or C-bend (modified J-bend)  
leads, tin-lead or RoHS compliant annealed matte-tin  
plating solderable to MIL-STD-750, method 2026  
t
clamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
Operating and Storage temperature: -65ºC to +150ºC  
Thermal resistance: 20ºC/W junction to lead, or 80ºC/W  
junction to ambient when mounted on FR4 PC board  
(1oz Cu) with recommended footprint (see last page)  
Steady-State Power dissipation: 6 watts at TL = 30oC,  
or 1.56 watts at TA = 25ºC when mounted on FR4 PC  
board with recommended footprint  
POLARITY: Cathode indicated by band. No marking  
on bi-directional devices  
MARKING: Part number without “SM” prefix (e.g.  
C5.0, C5.0A, C5.0CA, MXC5.0A, 5.0Ae3, C5.0CAe3,  
C36, C36A, C36CA, MAC36CA, 36CAe3, etc.)  
TAPE & REEL option: Standard per EIA-481-2 with  
16 mm tape, 750 per 7 inch reel or 2500 per 13 inch  
reel (add “TR” suffix to part number)  
Forward Surge: 200 Amps peak impulse of 8.3 ms  
half-sine wave at 25ºC (unidirectional only)  
Solder temperatures: 260 ºC for 10 s (maximum)  
WEIGHT: 0.25 grams  
Copyright © 2009  
SA3-43, REV F, 5-24-09  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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