TVS Diode
Surface Mount – 1500W > SMCG-HRA series
Pb e3
RoHS
SMCG-HRA Series
Description
The SMCG-HRA series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• High-Reliability up-
screened for critical
applications require higher
reliability performance
and low infant mortality
failures.
• Built-in strain relief
• Fast response time:
typically less than 1.0ps
from 0V to VBR min
• 1500W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
Agency Approvals
• Excellent clamping
capability
Agency
Agency File Number
E230531
• Low incremental surge
resistance
• Typical IR less than 1μA
when VBR min>12V
• VBR @TJ= VBR@25°C x (1+αT
x (TJ - 25)) (αT:Temperature
Coefficient, typical value is
0.1%)
• Surface mount component • Glass passivated chip
to optimize board space junction
• L bend lead forming gives • High temperature
Maximum Ratings andThermal Characteristics
(TA=25OC unless otherwise noted)
best solderbility for High
reliability application
•Typical failure mode is
short from over-specified
voltage or current
soldering guaranteed:
260°C/10 seconds at
terminals
• Meet MSL level1, per
J-STD-020
Parameter
Symbol
PPPM
PM(AV)
IFSM
Value
1500
6.5
Unit
W
W
A
Peak Pulse Power Dissipation (IPP x VC)by
10/1000µs waveform (Fig.2)(Note 1), (Note 2)
Power Dissipation on infinite heat sink at
TA=50OC
• Whisker test is conducted • Matte tin lead–free plated
based on JEDEC
Peak Forward Surge Current, 8.3ms Single
Half Sine Wave (Note 3)
200
• Halogen free
JESD201A per its table 4a
• RoHS compliant with
Maximum Instantaneous Forward Voltage at
100A for Unidirectional only
VF
3.5
V
and 4c
exemption 7a and 7c-I
• Pb-free E3 means 2nd
level interconnect is Pb-
free and the terminal finish
material is tin(Sn) (IPC/
JEDEC J-STD-609A.01)
Operating Junction and StorageTemperature
Range
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• EFT protection of data
lines in accordance with
IEC 61000-4-4
TJ, TSTG -65 to 150
°C
TypicalThermal Resistance Junction to Lead
RƟJL
RƟJA
15
75
°C/W
°C/W
TypicalThermal Resistance Junction to
Ambient
Notes:
1. Non-repetitive current pulse per Fig. 4 and derated above TA = 25OC per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional component only, duty
cycle=4 per minute maximum.
Functional Diagram
Applications
TVS components are ideal for the protection of I/O
Interfaces, VCC bus and other vulnerable circuits used in
Telecom, Computer, Industrial and Consumer electronic
applications.
Bi-directional
Cathode
Anode
Uni-directional
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/22/20