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SMBJ5955BP PDF预览

SMBJ5955BP

更新时间: 2024-11-13 13:00:39
品牌 Logo 应用领域
美微科 - MCC 稳压二极管齐纳二极管测试
页数 文件大小 规格书
2页 355K
描述
暂无描述

SMBJ5955BP 数据手册

 浏览型号SMBJ5955BP的Datasheet PDF文件第2页 
M C C  
SMBJ5913  
THRU  
SMBJ5956  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
21201 Itasca Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Features  
Silicon  
3.0 Watt  
Zener Diode  
·
·
·
·
·
Surface Mount Applications  
3.3 thru 200 Volt Voltage Range  
Ideal For High Density, Low Profile Mounting  
Withstands Large Surge Stresses  
Available on Tape and Reel  
DO-214AA  
(SMBJ) (Round Lead)  
Mechanical Data  
·
·
·
·
·
·
CASE: JEDEC DO-214AA molded Surface Mountable  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band  
H
Cathode Band  
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 260OC for 10 seconds  
For surface mount applications with flame retardent epoxy  
Meeting UL94V-0  
J
A
C
Maximum Ratings  
Steady State  
@
25OC Unless Otherwise Specified  
E
D
B
F
P(AV)  
3.0W  
(Note:1)  
Power  
G
Dissipation  
DIMENSIONS  
Operation And  
Storage  
Temperature  
Thermal  
INCHES  
MIN  
.078  
.075  
.002  
-----  
.035  
.065  
.205  
.160  
.130  
MM  
MIN  
1.98  
1.90  
.05  
-----  
.90  
1.65  
5.21  
4.06  
3.30  
-55OC to  
+150OC  
25OC/W  
DIM  
A
B
C
D
E
MAX  
.116  
.089  
.008  
.02  
.055  
.091  
.224  
.180  
.155  
MAX  
2.95  
2.25  
.20  
NOTE  
TJ, TSTG  
R
.51  
1.40  
2.32  
5.69  
4.57  
3.94  
Resistance  
F
G
H
J
NOTE:  
Mounted on 4.0mm2 copper pads to each terminal.  
Lead temperature at TL=75oC  
SUGGESTED SOLDER  
PAD LAYOUT  
1.  
0.090"  
0.085”  
0.070”  
www.mccsemi.com  

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