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SMBJ5937B-TP PDF预览

SMBJ5937B-TP

更新时间: 2024-11-25 19:38:39
品牌 Logo 应用领域
美微科 - MCC 测试光电二极管
页数 文件大小 规格书
4页 347K
描述
Zener Diode, 33V V(Z), 5%, 1.5W, Silicon, Unidirectional, DO-214AA, SMB, 2 PIN

SMBJ5937B-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DO-214AA
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.24
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:33 Ω
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:1.5 W
认证状态:Not Qualified标称参考电压:33 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10最大电压容差:5%
工作测试电流:11.4 mABase Number Matches:1

SMBJ5937B-TP 数据手册

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SMBJ5913B  
THRU  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
SMBJ5956B  
Features  
1.5 Watt  
Surface Mount  
Silicon  
Halogen free available upon request by adding suffix "-HF"  
Surface Mount Application  
3.3 thru 200 Volt Voltage Range  
Low Inductance,Low Profile Mounting  
Glass Passivated Junction  
Zener Diodes  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Mechanical Data  
DO-214AA  
CASE: JEDEC DO-214AA molded Surface Mountable  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
(SMB) (LEAD FRAME)  
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 260oC for 10 seconds.  
A
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
B
Maximum Ratings @ 25oC Unless Otherwise Specified  
Output  
IF  
C
200mA  
Current  
Maximum  
VF  
1.5V  
(Note: 2)  
(Note: 3)  
F
H
Forward  
Voltage  
D
G
Steady State  
Power  
P(AV)  
1.5W  
E
Dissipation  
DIMENSIONS  
Operation And  
TJ, TSTG -55oC to  
+150 oC  
INCHES  
MIN  
MM  
MIN  
Storage  
DIM  
A
B
C
D
E
F
G
H
MAX  
.185  
.155  
.012  
.060  
.220  
.096  
.087  
.008  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.44  
2.21  
0.203  
NOTE  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
4.06  
3.30  
0.15  
0.76  
5.08  
2.00  
1.91  
0.05  
Temperature  
NOTES:  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
2. Forward Current @ 200mA.  
3. Mounted on 5.0mm2 (1oz thick) Iand areas.  
SUGGESTED SOLDER  
PAD LAYOUT  
Lead temperature at TL=75oC  
0.106"  
0.083”  
0.050”  
www.mccsemi.com  
Revision: D  
2013/01/01  
1 of 4  

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