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SMBJ5371B PDF预览

SMBJ5371B

更新时间: 2024-11-06 22:59:11
品牌 Logo 应用领域
美高森美 - MICROSEMI 稳压二极管齐纳二极管
页数 文件大小 规格书
3页 245K
描述
5 Watt Surface Mount Silicon Zener Diodes

SMBJ5371B 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:R-PDSO-J2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.76Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODEJEDEC-95代码:DO-214AA
JESD-30 代码:R-PDSO-J2JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-65 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:1.38 W标称参考电压:60 V
表面贴装:YES技术:ZENER
端子面层:TIN LEAD端子形式:J BEND
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大电压容差:5%工作测试电流:20 mA
Base Number Matches:1

SMBJ5371B 数据手册

 浏览型号SMBJ5371B的Datasheet PDF文件第2页浏览型号SMBJ5371B的Datasheet PDF文件第3页 
SMBG5333B thru SMBG5388B  
and  
SMBJ5333B thru SMBJ5388B  
8700 E. Thomas Road  
Scottsdale, AZ 85252  
Tel: (480) 941-6300  
Fax: (480) 947-1503  
Features  
5 Watt  
Surface Mount  
Silicon  
·
Low profile package for surface mounting (flat handling  
surface for accurate placement)  
·
·
·
·
Zener Voltage 3.3V to 200V  
High Surge Current Capability  
For available tolerances – see note 1  
Zener Diodes  
Available on Tape and Reel (see EIA std RS-481)  
Mechanical Data  
·
·
Standard JEDEC outlines as shown  
Terminals gull-wing or c-bend (modified J-bend) tin-lead plated  
and solderable per MIL-STD-750, method 2026  
·
·
Polarity is indicated by cathode band  
Maximum temperature for soldering: 260oC for 10 seconds.  
Maximum Ratings @ 25oC Unless Otherwise Specified  
VF  
1.2 Volts  
Forward Voltage at 1.0A  
Current  
P(AV)  
5 Watts  
See note 2  
Steady State Power  
Dissipation  
TJ, TSTG  
-65oC to  
+ 150oC  
Operating and Storage  
Temperatures  
25oC/W  
RqJL  
Thermal Resistance  
Notes  
1. Mounted on copper pads as shown below.  
2. Lead temperature at 25oC = TL at mounting plane. Derate  
linearly above 25oC to zero power at 150 oC  
Pad Layout  
Gull Wing  
Modified J-Bend  
0.089  
0.150  
0.085  
Datasheet# MSC0302A  
Date: 06/26/97  

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