SMBJ5338B
THRU
SMBJ5369B
M C C
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
5 Watt
xꢀ Low Profile Package for Surface Mountiong(Flat Handling
Surface for Accurate Placement)
Surface Mount Silicon
Zener Diode
xꢀ Zener Voltage 5.1V to 51V
xꢀ High Surge Current Capability
xꢀ For Available Tolerances-see Note 1
xꢀ Available on Tape and Reel (see E1A std RS-481)
5.1 to 51 Volts
DO-214AA
(SMB) (Lead Frame)
H
Mechanical Data
xꢀ Standard JEDEC Outlines as Shown
xꢀ Marking: See page 2
J
xꢀ Maximum Temperature for Soldering: 260к for 10 Seconds
x
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Electrical Characteristics @ 25qC Unless Otherwise Specified
A
C
Forward Voltage at
VF
1.2Volts
1.0A Current
E
D
B
Steady State Power
Dissipation
P(AV)
5Watts See Note 2
Operating and Storage
Temperatures
Thermal Resistance
G
-55к to +150к
25к/W
TJ, TSTG
RșJL
DIMENSIONS
INCHES
MIN
.075
.077
.002
-----
.030
.200
.160
.130
MM
MIN
1.91
1.96
.05
-----
.76
5.08
4.06
3.30
DIM
A
B
C
D
E
G
H
MAX
.095
.083
.008
.02
.060
.220
.187
.155
MAX
2.41
2.10
.20
NOTE
Note: 1. Mounted on copper pads as shown below.
2. Lead temperature at 25к = TL at mounting plane. Derate linearly
above 25к to zero power at 150 к
.51
1.52
5.59
4.75
3.94
J
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
0.070”
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Revision: 7
2007/04/25