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SMBJ5369A-TP PDF预览

SMBJ5369A-TP

更新时间: 2024-11-22 20:42:43
品牌 Logo 应用领域
美微科 - MCC 测试光电二极管
页数 文件大小 规格书
4页 229K
描述
Zener Diode, 51V V(Z), 20%, 5W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMB, 2 PIN

SMBJ5369A-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DO-214AA
包装说明:PLASTIC, SMB, 2 PIN针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.38
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:27 Ω
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:5 W
认证状态:Not Qualified标称参考电压:51 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子面层:Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10最大电压容差:20%
工作测试电流:25 mABase Number Matches:1

SMBJ5369A-TP 数据手册

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SMBJ5338B  
THRU  
SMBJ5369B  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
5 Watt  
xꢀ Low Profile Package for Surface Mountiong(Flat Handling  
Surface for Accurate Placement)  
Surface Mount Silicon  
Zener Diode  
xꢀ Zener Voltage 5.1V to 51V  
xꢀ High Surge Current Capability  
xꢀ For Available Tolerances-see Note 1  
5.1 to 51 Volts  
xꢀ Available on Tape and Reel (see E1A std RS-481)  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
DO-214AA  
(SMB) (Lead Frame)  
H
Mechanical Data  
xꢀ Standard JEDEC Outlines as Shown  
xꢀ Marking: See page 2  
J
xꢀ Maximum Temperature for Soldering: 260к for 10 Seconds  
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
Electrical Characteristics @ 25qC Unless Otherwise Specified  
A
C
Forward Voltage at  
VF  
1.2Volts  
1.0A Current  
E
D
B
Steady State Power  
Dissipation  
P(AV)  
5Watts See Note 2  
Operating and Storage  
Temperatures  
Thermal Resistance  
G
-55к to +150к  
25к/W  
TJ, TSTG  
RșJL  
DIMENSIONS  
INCHES  
MIN  
.075  
.077  
.002  
-----  
.030  
.200  
.160  
.130  
MM  
MIN  
1.91  
1.96  
.05  
-----  
.76  
5.08  
4.06  
3.30  
DIM  
A
B
C
D
E
G
H
MAX  
.095  
.083  
.008  
.02  
.060  
.220  
.187  
.155  
MAX  
2.41  
2.10  
.20  
NOTE  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
Note:  
2. Lead temperature at 25к = TL at mounting plane. Derate linearly  
above 25к to zero power at 150 к  
.51  
1.52  
5.59  
4.75  
3.94  
J
SUGGESTED SOLDER  
PAD LAYOUT  
0.090"  
0.085”  
0.070”  
www.mccsemi.com  
1 of 4  
Revision: A  
2011/01/01  

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