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SMBJ30CA PDF预览

SMBJ30CA

更新时间: 2024-12-01 12:27:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 瞬态抑制器二极管光电二极管局域网
页数 文件大小 规格书
10页 133K
描述
Transil

SMBJ30CA 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:R-PDSO-C2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.63Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:179981
Samacsys Pin Count:2Samacsys Part Category:Diode
Samacsys Package Category:OtherSamacsys Footprint Name:SMB
Samacsys Released Date:2015-07-22 14:41:32Is Samacsys:N
最小击穿电压:33.3 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
最大非重复峰值反向功率耗散:4000 W元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:BIDIRECTIONAL
最大功率耗散:5 W最大重复峰值反向电压:30 V
表面贴装:YES技术:AVALANCHE
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

SMBJ30CA 数据手册

 浏览型号SMBJ30CA的Datasheet PDF文件第2页浏览型号SMBJ30CA的Datasheet PDF文件第3页浏览型号SMBJ30CA的Datasheet PDF文件第4页浏览型号SMBJ30CA的Datasheet PDF文件第5页浏览型号SMBJ30CA的Datasheet PDF文件第6页浏览型号SMBJ30CA的Datasheet PDF文件第7页 
SMBJ  
Transil™  
Features  
Peak pulse power:  
– 600 W (10/1000 μs)  
– 4 kW (8/20 µs)  
A
Stand off voltage range: from 5 V to 188 V  
Unidirectional and bidirectional types  
K
Unidirectional  
Bidirectional  
Low leakage current:  
– 0.2 µA at 25 °C  
– 1 µA at 85 °C  
SMB  
(JEDEC DO-214AA)  
Operating T  
: 150 °C  
j max  
High power capability at T  
:
j max  
– 515 W (10/1000 µs)  
Description  
JEDEC registered package outline  
The SMBJ Transil series has been designed to  
protect sensitive equipment against electrostatic  
discharges according to IEC 61000-4-2, and  
MIL STD 883, method 3015, and electrical over  
stress according to IEC 61000-4-4 and 5. These  
devices are more generally used against surges  
below 600 W (10/1000 μs).  
Complies with the following standards  
IEC 61000-4-2 level 4:  
– 15 kV (air discharge)  
– 8 kV (contact discharge)  
IEC 61000-4-5  
MIL STD 883G, method 3015-7 Class 3B:  
Planar technology makes these devices suitable  
for high-end equipment and SMPS where low  
leakage current and high junction temperature are  
required to provide reliability and stability over  
time.  
– 25 kV HBM (human body model)  
Resin meets UL 94, V0  
MIL-STD-750, method 2026 soldererability  
EIA STD RS-481 and IEC 60286-3 packing  
IPC 7531 footprint  
SMBJ are packaged in SMB (SMB footprint in  
accordance with IPC 7531 standard).  
TM: Transil is a trademark of STMicroelectronics  
October 2010  
Doc ID 5616 Rev 10  
1/10  
www.st.com  
10  

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