SMBJ5.0 thru SMBJ170CA
and SMBG5.0 thru SMBG170CA
SURFACE MOUNT 600 Watt
Transient Voltage Suppressor
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive
components from destruction or degradation. It is available in J-bend design
(SMBJ) with the DO-214AA package for greater PC board mounting density
or in a Gull-wing design (SMBG) in the DO-215AA for visible solder
connections. It is also available in both unidirectional and bidirectional
configurations with a C or CA suffix part number. Their response time is
virtually instantaneous. As a result, they can be used for protection from ESD
or EFT per IEC61000-4-2 and IEC61000-4-4, or for inductive switching
environments and induced RF protection. They can also protect from
secondary lightning effects per IEC61000-4-5 and class levels defined herein.
Microsemi also offers numerous other TVS products to meet higher and lower
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
power demands and special applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Economical surface mount design in both J-bend or
•
Protects sensitive components such as IC’s, CMOS,
Bipolar, BiCMOS, ECL, DTL, T2L, etc.
Gull-wing terminations
•
Available in both unidirectional and bidirectional
construction (add C or CA suffix for bidirectional)
Selections for 5.0 to 170 volts standoff voltages (VWM)
•
•
Protection from switching transients & induced RF
Compliant to IEC61000-4-2 and IEC61000-4-4 for
•
•
ESD and EFT protection respectively
Suppresses transients up to 600 watts @ 10/1000 µs
•
•
Secondary lightning protection per IEC61000-4-5
with 42 Ohms source impedance:
(see Figure 1)
•
•
Fast response
Class 1: SMB 5.0 to SMB 120A or CA
Class 2: SMB 5.0 to SMB 60A or CA
Class 3: SMB 5.0 to SMB 30A or CA
Class 4: SMB 5.0 to SMB 15A or CA
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
Axial-lead equivalent packages for thru-hole mounting
available as P6KE6.8 to P6KE200CA (consult factory
for other surface mount options)
Secondary lightning protection per IEC61000-4-5
•
•
with 12 Ohms source impedance:
Class 1: SMB 5.0 to SMB 36A or CA
Class 2: SMB 5.0 to SMB 18A or CA
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Peak Pulse Power dissipation at 25ºC: 600 watts at
•
CASE: Void-free transfer molded thermosetting
10/1000 µs (also see Fig 1,2, and 3).
epoxy body meeting UL94V-0
• Impulse repetition rate (duty factor): 0.01%
•
TERMINALS: Gull-wing or C-bend (modified J-bend)
leads, tin-lead plated solderable per MIL-STD-750,
method 2026
• tclamping (0 volts to V(BR) min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
• Operating and Storage temperature: -65ºC to +150ºC
•
•
•
POLARITY: Cathode indicated by band. No
marking on bi-directional devices
• Thermal resistance: 25 ºC/W junction to lead, or 90ºC/W
junction to ambient when mounted on FR4 PC board
(1oz Cu) with recommended footprint (see last page)
MARKING: Part number without prefix (e.g. 5.0,
5.0A, 5.0CA, 36, 36A, 36CA, etc.)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimension on last page
• Steady-State Power dissipation: 5 watts at TL = 25oC,
or 1.38 watts at TA = 25ºC when mounted on FR4 PC
board with recommended footprint
•
•
• Forward Surge at 25ºC: 50 Amps peak impulse of 8.3
ms half-sine wave (unidirectional only)
• Solder temperatures: 260 ºC for 10 s (maximum)
Copyright 2002
10-14-2003 REV C
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
5秒后页面跳转
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
