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SMBG7.5CTR PDF预览

SMBG7.5CTR

更新时间: 2024-10-29 13:13:35
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
4页 202K
描述
600W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-215AA, PLASTIC PACKAGE-2

SMBG7.5CTR 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:DO-215AA包装说明:R-PDSO-G2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.75Is Samacsys:N
最大击穿电压:10.2 V最小击穿电压:8.33 V
击穿电压标称值:9.27 V最大钳位电压:14.3 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJEDEC-95代码:DO-215AA
JESD-30 代码:R-PDSO-G2JESD-609代码:e0
湿度敏感等级:1最大非重复峰值反向功率耗散:600 W
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性:BIDIRECTIONAL最大功率耗散:1.38 W
认证状态:Not Qualified最大重复峰值反向电压:7.5 V
子类别:Transient Suppressors表面贴装:YES
技术:AVALANCHE端子面层:Tin/Lead (Sn90Pb10)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

SMBG7.5CTR 数据手册

 浏览型号SMBG7.5CTR的Datasheet PDF文件第2页浏览型号SMBG7.5CTR的Datasheet PDF文件第3页浏览型号SMBG7.5CTR的Datasheet PDF文件第4页 
SMBJ5.0 thru SMBJ170CA  
and SMBG5.0 thru SMBG170CA  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W  
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive  
components from destruction or degradation. It is available in J-bend design  
(SMBJ) with the DO-214AA package for greater PC board mounting density  
or in a Gull-wing design (SMBG) in the DO-215AA for visible solder  
connections. It is also available in both unidirectional and bidirectional  
configurations with a C or CA suffix part number. Their response time is  
virtually instantaneous. As a result, they can be used for protection from ESD  
or EFT per IEC61000-4-2 and IEC61000-4-4, or for inductive switching  
environments and induced RF protection. They can also protect from  
secondary lightning effects per IEC61000-4-5 and class levels defined herein.  
Microsemi also offers numerous other TVS products to meet higher and lower  
NOTE: All SMB series are  
equivalent to prior SMS package  
identifications.  
power demands and special applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Economical surface mount design in both J-bend or  
Protects sensitive components such as IC’s, CMOS,  
Bipolar, BiCMOS, ECL, DTL, T2L, etc.  
Gull-wing terminations  
Available in both unidirectional and bidirectional  
construction (add C or CA suffix for bidirectional)  
Selections for 5.0 to 170 volts standoff voltages (VWM)  
Protection from switching transients & induced RF  
Compliant to IEC61000-4-2 and IEC61000-4-4 for  
ESD and EFT protection respectively  
Suppresses transients up to 600 watts @ 10/1000 µs  
Secondary lightning protection per IEC61000-4-5  
with 42 Ohms source impedance:  
(see Figure 1)  
Fast response  
Class 1: SMB 5.0 to SMB 120A or CA  
Class 2: SMB 5.0 to SMB 60A or CA  
Class 3: SMB 5.0 to SMB 30A or CA  
Class 4: SMB 5.0 to SMB 15A or CA  
Options for screening in accordance with MIL-PRF-  
19500 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or MSP prefixes  
respectively to part numbers.  
Axial-lead equivalent packages for thru-hole mounting  
available as P6KE6.8 to P6KE200CA (consult factory  
for other surface mount options)  
Secondary lightning protection per IEC61000-4-5  
with 12 Ohms source impedance:  
Class 1: SMB 5.0 to SMB 36A or CA  
Class 2: SMB 5.0 to SMB 18A or CA  
Moisture classification is Level 1 with no dry pack  
required per IPC/JEDEC J-STD-020B  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Peak Pulse Power dissipation at 25ºC: 600 watts at  
CASE: Void-free transfer molded thermosetting  
10/1000 µs (also see Fig 1,2, and 3).  
epoxy body meeting UL94V-0  
Impulse repetition rate (duty factor): 0.01%  
TERMINALS: Gull-wing or C-bend (modified J-bend)  
leads, tin-lead plated solderable per MIL-STD-750,  
method 2026  
tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
Operating and Storage temperature: -65ºC to +150ºC  
POLARITY: Cathode indicated by band. No  
marking on bi-directional devices  
Thermal resistance: 25 ºC/W junction to lead, or 90ºC/W  
junction to ambient when mounted on FR4 PC board  
(1oz Cu) with recommended footprint (see last page)  
MARKING: Part number without prefix (e.g. 5.0,  
5.0A, 5.0CA, 36, 36A, 36CA, etc.)  
TAPE & REEL option: Standard per EIA-481-1-A  
with 12 mm tape, 750 per 7 inch reel or 2500 per 13  
inch reel (add “TR” suffix to part number)  
WEIGHT: 0.1 grams  
See package dimension on last page  
Steady-State Power dissipation: 5 watts at TL = 25oC,  
or 1.38 watts at TA = 25ºC when mounted on FR4 PC  
board with recommended footprint  
Forward Surge at 25ºC: 50 Amps peak impulse of 8.3  
ms half-sine wave (unidirectional only)  
Solder temperatures: 260 ºC for 10 s (maximum)  
Copyright 2002  
10-14-2003 REV C  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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