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SMAJP4KE16C-TP PDF预览

SMAJP4KE16C-TP

更新时间: 2024-12-02 08:03:35
品牌 Logo 应用领域
美微科 - MCC 二极管
页数 文件大小 规格书
5页 330K
描述
Trans Voltage Suppressor Diode

SMAJP4KE16C-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.71二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
湿度敏感等级:1峰值回流温度(摄氏度):260
处于峰值回流温度下的最长时间:10Base Number Matches:1

SMAJP4KE16C-TP 数据手册

 浏览型号SMAJP4KE16C-TP的Datasheet PDF文件第2页浏览型号SMAJP4KE16C-TP的Datasheet PDF文件第3页浏览型号SMAJP4KE16C-TP的Datasheet PDF文件第4页浏览型号SMAJP4KE16C-TP的Datasheet PDF文件第5页 
SMAJP4KE6.8(C)A  
THRU  
SMAJP4KE550(C)A  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
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TM  
Micro Commercial Components  
Features  
For surface mount applicationsin in order to optimize  
Transient  
Voltage Suppressor  
6.8 to 550 Volts  
boar d space  
Low profile package  
Fast response time: typical less than 1.0ps from 0 volts to  
400 Watt  
VBR minimum  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
DO-214AC  
UL Recognized File # E331408  
(SMAJ)(LEAD FRAME)  
Unidirectional and bidirectional available,for bidirectional  
devices add 'C' suffix to the pn#, i.e.SMAJP4KE6.8CA  
H
Mechanical Data  
J
CASE: JEDEC DO-214AC  
Terminals: solderable per MIL-STD-750, Method 2026  
Polarity: Color band denotespositive end (cathode)  
except Bidirectional  
Maximum soldering temperature: 260oC for 10 seconds  
Typical Thermal Resistance: 100 /W Junction to Ambient  
A
C
Maximum Ratings @ 25oC Unless Otherwise Specified  
E
D
B
F
Peak Pulse Current on  
10/1000us waveform  
IPP  
See Table 1 Note: 1  
G
Peak Pulse Power  
PPP  
400W  
Note: 1,  
DIMENSIONS  
Dissipation  
INCHES  
MIN  
.079  
.050  
.002  
---  
MM  
MIN  
2.00  
1.27  
.05  
-55oC to  
DIM  
A
MAX  
MAX  
2.44  
1.63  
.20  
NOTE  
Operation And Storage TJ, TSTG  
Temperature Range  
.096  
.064  
.008  
.02  
+175oC  
B
C
D
E
---  
.51  
.030  
.065  
.189  
.157  
.090  
.060  
.091  
.220  
.181  
.115  
.76  
1.52  
2.32  
5.59  
4.60  
2.92  
F
1.65  
4.80  
4.00  
2.25  
G
H
J
SUGGESTED SOLDER  
PAD LAYOUT  
0.090”  
0.085”  
NOTES:  
1. Non-repetitive current pulse, per Fig.3 and derated above  
TA=25oC per Fig.2.  
2. Mounted on 5.0mm2 copper pads to each terminal.  
0.070"  
www.mccsemi.com  
1 of 5  
Revision: F  
2013/07/18  

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