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SMAJ4742AP PDF预览

SMAJ4742AP

更新时间: 2024-11-08 18:16:07
品牌 Logo 应用领域
美微科 - MCC 测试光电二极管
页数 文件大小 规格书
4页 428K
描述
DIODE 12 V, 1 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC, PLASTIC, SMAJ, 2 PIN, Voltage Regulator Diode

SMAJ4742AP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DO-214AC
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.48
其他特性:LOW IMPEDANCE配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:9 ΩJEDEC-95代码:DO-214AC
JESD-30 代码:R-PDSO-C2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:200 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:1 W
认证状态:Not Qualified标称参考电压:12 V
子类别:Voltage Reference Diodes表面贴装:YES
技术:ZENER端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10最大电压容差:5%
工作测试电流:21 mABase Number Matches:1

SMAJ4742AP 数据手册

 浏览型号SMAJ4742AP的Datasheet PDF文件第2页浏览型号SMAJ4742AP的Datasheet PDF文件第3页浏览型号SMAJ4742AP的Datasheet PDF文件第4页 
M C C  
SMAJ4728A  
THRU  
SMAJ4764A  
TM  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Micro Commercial Components  
Features  
·
Low Zener Impedance  
Low Regulation Factor  
VZ – tolerance: 5%  
1 Watt  
Zener Diode  
For Surface Mount Applications  
Epoxy meets UL 94 V-0 flammability rating  
3.3 to 100 Volts  
·
Moisture Sensitivity Level 1  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
DO-214AC  
(SMA)(LEAD FRAME)  
Maximum Ratings@25Unless Otherwise Specified  
H
Parameters  
Test Conditions  
Symbol  
Value  
Unit  
W
Power Dissipation  
Pd  
1
Tamb50℃  
Z-Current  
Iz  
Pd/Vz  
mA  
J
Operating  
Tj  
-65~+150  
Junction Temperature  
Storage Temperature  
Tstg  
-65~+150  
100  
75  
A
RΘja  
RΘjL  
FR-4 Board, MCC's  
C
Thermal Resistence  
K/W  
V
Suggested Solder Pad  
E
D
B
Max. Forward Voltage Drop  
IF=100mA  
Vf  
1.2  
F
G
DIMENSIONS  
INCHES  
MIN  
.079  
.050  
.002  
---  
MM  
MIN  
2.00  
1.27  
.05  
DIM  
A
MAX  
MAX  
2.44  
1.63  
.20  
NOTE  
.096  
.064  
.008  
.02  
B
C
D
E
---  
.51  
.030  
.065  
.189  
.157  
.090  
.060  
.091  
.220  
.181  
.115  
.76  
1.52  
2.32  
5.59  
4.60  
2.92  
F
1.65  
4.80  
4.00  
2.25  
G
H
J
SUGGESTED SOLDER  
PAD LAYOUT  
0.090”  
MAX  
0.058 ”  
MIN  
0.070"  
MIN  
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
www.mccsemi.com  
Revision: C  
2012/01/11  
1 of 4  

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