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SMAJ4468C PDF预览

SMAJ4468C

更新时间: 2024-11-01 13:13:35
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管齐纳二极管测试光电二极管
页数 文件大小 规格书
2页 93K
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SMAJ4468C 数据手册

 浏览型号SMAJ4468C的Datasheet PDF文件第2页 
SMAJ4460 thru SMAJ4496  
and SMAJ6485 thru SMAJ6491  
1.5 Watt Zener Diodes  
S C O T T S D A L E D I V I S I O N  
SURFACE MOUNT  
DESCRIPTION  
ZENER  
This 1.5 watt zener series in a low-profile light-weight plastic surface mount  
configuration, with stress-relief J-bend contacts, meets or exceeds the electrical  
performance of the 1N4460 thru 1N4496 and 1N6485 thru 1N6491. It also provides  
double the overall surge performance by using a larger active die element. This  
includes ESD protection per IEC61000-4-2, EFT protection per IEC61000-4-4, and  
higher surge levels defined herein. The low-flat profile provides easier insertion or  
automatic handling compared to other MELF style packages. Its thermally efficient  
design lowers junction temperatures and extends operating temperature range  
before derating begins. Power derates to zero at 150°C for these plastic packages.  
DO-214BA or AC  
(SMAJ)  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
·
·
·
Zener voltages: 3.3 volts to 200 volts  
Metallurgically bonded  
· For high reliability voltage regulation in low profile  
surface mount locations requiring easy  
placement and strain relief  
· Light weight for airborne or satellite applications  
· Superior surge quality to protect from ESD and  
EFT transients per IEC61000-4-2 and -4-4 and  
higher surge levels defined herein  
Reliability data per JESD22-A108, JESD22-A104,  
JESD22-A113-B, JESD22-A101-B, and JESD22-A102  
Thermally efficient surface mount with J-bends for  
stress relief (flat handling surface for easier placement)  
Options for screening in accordance with MIL-PRF-  
19500/406 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or MSP prefixes  
respectively to part numbers. For example, designate a  
MXSMAJ4460 for a JANTX screen.  
·
·
MECHANICAL AND PACKAGING  
· Molded epoxy package meets UL94V-0  
· Terminals: solderable per MIL-STD-750  
Method 2026. (max 260 °C for 10 sec.)  
· Body marked with P/N without SMAJ letters  
(ie. 4460, 4496, 6485, 4460, etc.)  
MAXIMUM RATINGS  
· Polarity is indicated by cathode band  
· Weight: 0.064 grams (approximate)  
· Tape & Reel packaging per EIA-481-2 with 12  
mm tape and 2500 units per reel (13 inch reel)  
·
·
·
·
Operating temperature: -55°C to +150°C  
Storage temperature: -55°C to +150°C  
1.5 watt steady-state maximum power  
Thermal resistance, R?JL = 15 °C/W  
POWER DERATING – OUTLINE – MOUNTING PAD  
DIMENSIONS  
MILLIMETERS  
INCHES  
DIM  
MIN  
.052  
.160  
.100  
.194  
.078  
.030  
--  
MAX  
.103  
.180  
.110  
.216  
.115  
.060  
.005  
MIN  
1.32  
4.06  
2.54  
4.93  
1.98  
0.76  
--  
MAX  
2.62  
4.57  
2.79  
5.49  
2.92  
1.52  
0.13  
A
B
C
D
E
F
G
DIMENSION A IS WITHIN DO-214BA BUT HIGHER THAN  
STANDARD JEDEC OUTLINES..DIMENSION B IS WIDER  
THAN BOTH JEDEC OUTLINES FOR LOWER THERMAL  
RESISTANCE  
Outline  
Mounting Pad  
Copyright ã 2001  
MSCXXXX.PDF 4-07-03 REV A  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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