RoHS
SMA5921AQ THRU SMA5956AQ
Surface Mount Zener Diodes
COMPLIANT
Features
● Low profile package
● Ideal for automated placement
● Glass passivated chip junction
● Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
● Part no. with suffix “Q” means AEC-Q101 qualified
Mechanical Data
●
ackage: DO-214AC (SMA)
P
Molding compound meets UL 94 V-0 flammability
rating, RoHS-compliant, halogen-free
● Terminals: Tin plated leads, solderable per
J-STD-002 and JESD22-B102
●
Cathode line denotes the cathode end
Polarity:
(T =25℃ Unless otherwise specified
■
Maximum Ratings
)
a
PARAMETER
SYMBOL
MAX
1.5
UNIT
W
DC power dissipation at TL = 75 °C
Maximum instantaneous forward voltage@ IF=200mA
Maximum junction temperature
PD
VF
V
1.5
Tj
-55 to +150
-55 to +150
℃
℃
Storage temperature range
Tstg
Thermal Characteristics (T =25℃Unless otherwise specified)
■
a
Conditions
junction to lead
junction to ambient
VALUE
PARAMETER
SYMBOL
UNIT
℃/W
℃/W
(1)
RθJ-L
30
Thermal resistance(Typical)
(1)
RθJ-A
120
Note
(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.4" x 0.4" (10 mm x 10 mm) copper pad areas
(T =25℃Unless otherwise specified)
■Electrical Characteristics
a
Test
current
Maximum dynamic
impedance resistance
Maximum reverse
leakage current
Maximum DC
Zener Current
Nominal Zener voltage
Min
Typ.
Max
Part Number
IZT
ZZT at IZT ZZK at IZK
IZK
IR
Test voltage VR
IZM
VZ (1)at IZT
VZ (1)at IZT
VZ (1)at IZT
V
V
V
mA
Ω
Ω
mA
μA
V
mA
SMA5921AQ
SMA5922AQ
SMA5923AQ
SMA5924AQ
SMA5925AQ
6.46
7.13
7.79
8.65
9.50
6.8
7.5
8.2
9.1
10.0
7.14
7.88
8.61
9.56
10.50
55.1
50.0
45.7
41.2
37.5
2.5
3.0
3.5
4.0
4.5
200
400
400
500
500
1.00
0.50
0.50
0.50
0.25
10.0
10.0
10.0
10.0
10.0
5.2
6.0
6.5
7.0
8.0
221.0
200.0
183.0
165.0
150.0
1 / 5
S-S4845
Rev.1.0,07-Dec-22
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com