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SM330DT PDF预览

SM330DT

更新时间: 2024-11-07 01:20:27
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SECOS /
页数 文件大小 规格书
2页 219K
描述
Surface Mount Schottky Barrier Rectifiers

SM330DT 数据手册

 浏览型号SM330DT的Datasheet PDF文件第2页 
SM320DT~SM340DT  
Voltage 20V~40V, 3Amp  
Surface Mount Schottky Barrier Rectifiers  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen-free and RoHS Compliant  
FEATURES  
Heatsink Structure  
Low Profile, Typical Thickness 0.8mm  
Moisture Sensitivity: Level 1, Per J-STD-020  
SOD-123DT  
High Temperature Soldering Guaranteed: 260°C/10 Se conds  
MARKING  
PS34  
PACKAGE INFORMATION  
Package  
MPQ  
Leader Size  
SOD-123DT  
3K  
7 inch  
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
2.9  
Max.  
3.1  
Min.  
Max.  
ORDER INFORMATION  
A
B
C
D
E
F
G
H
I
0.85  
1.05  
1.9  
2.1  
0.6 REF.  
Part Number  
Type  
0.75  
3.5  
0.9  
3.9  
0.4  
1.66 REF.  
1.3  
0.85  
1.7  
0.1  
0.25  
J
SM320DT~SM340DT  
Lead (Pb)-free  
SM320DT-C~SM340DT-C  
Lead (Pb)-free and Halogen-free  
1
Cathode  
2
Anode  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
Part Number  
Parameter  
Symbol  
Unit  
SM320DT  
SM330DT  
SM340DT  
Maximum Repetitive Peak Reverse Voltage  
Maximum RMS Voltage  
VRRM  
VRMS  
VDC  
VBR  
IF  
20  
14  
20  
30  
21  
30  
40  
3
40  
28  
40  
V
V
V
V
A
Maximum DC Blocking Voltage  
Minimum Breakdown Voltage @IR=1mA  
Maximum Average Forward Rectified Current  
Peak Forward Surge Current@ 8.3 ms Single Half  
Sine-Wave Superimposed on Rate Load  
IFSM  
I2t  
100  
A
Rating for Fusing (t<8.3ms)  
42  
0.51  
0.45  
50  
A2S  
IF=3A, TA=25°C  
IF=3A, TA=125°C  
TA=25°C  
Maximum Instantaneous Forward  
Voltage  
VF  
IR  
V
uA  
mA  
pF  
Maximum DC Reverse Current at  
Rated DC Blocking Voltage  
TA=125°C  
10  
Typical Junction Capacitance  
4V, 1MHz  
CJ  
RθJA  
229  
60  
Typical Thermal Resistance from Junction to Ambient 1  
Typical Thermal Resistance from Junction to Case 2  
Typical Thermal Resistance from Junction to Lead 1  
Operating Junction and Storage Temperature  
°C/W  
°C  
RθJC  
28  
RθJL  
6
TJ, TSTG  
-55~150  
Notes:  
1.  
The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads, 2 OZ, FR4 PCB.  
The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads, 2 OZ, FR4 PCB.  
2.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
10-Apr-2018 Rev. B  
Page 1 of 2  

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