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SM2404T-7.5 PDF预览

SM2404T-7.5

更新时间: 2024-01-22 00:41:22
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟光电二极管
页数 文件大小 规格书
100页 1871K
描述
Memory IC, 1MX16, CMOS, PDSO50,

SM2404T-7.5 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:SOP,针数:50
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.75
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G50
内存密度:67108864 bit内存集成电路类型:CACHE DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:50
字数:4194304 words字数代码:4000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX16
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified自我刷新:YES
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子位置:DUAL
Base Number Matches:1

SM2404T-7.5 数据手册

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0316409C 4M  
x 412/10, 3.3V, SR. 0316169C 1M x 1612/8, 3.3V, SR. 0316809C 2M x 812/9, 3.3V, SR.  
4Mx4, 2Mx8, 1Mx16  
Preliminary Data Sheet  
16Mbit Enhanced Synchronous DRAM  
Overview  
Features  
• High Performance:  
CAS latency = 2  
• Programmable Burst Length: 1,2,4,8,full-page  
-6.6 -7.5  
-10  
100  
10  
Units  
MHz  
ns  
• Programmable Wrap Sequence, Sequential or  
Interleaved  
fCK  
tCK2  
tAC2  
Clock Frequency  
Clock Cycle  
150  
6.6  
4.3  
133  
7.5  
4.5  
• Automatic and Controlled Precharge Command  
• Hidden Precharge and Hidden Auto Refresh  
• Self Refresh  
Clock Access Time  
5
ns  
• 8Kbit SRAM Row Cache  
• Supports Row Pipelining for Random Row  
• Suspend Mode and Power Down Mode  
• 2048 refresh cycles / 64ms  
Reads of 4:1:1:1:2:1:1:1:2:1:1:1 @ 133MHz  
• Compatible with JEDEC Standard SDRAMs  
• Single 3.3V Power Supply  
• JEDEC Superset Standard ESDRAM  
• Programmable Caching Policy  
• LVTTL and 2.5V I/O Interface with Flexible VDDQ  
• Package: 44 pin 400 mil TSOP-Type II (x4,x8)  
50 pin 400 mil TSOP-Type II (x16)  
• Programmable CAS Latency: 1, 2, 3  
• Dual Banks controlled by A11 (Bank Select)  
Description  
to perform operations on the DRAM array concur-  
rent with cache reads. These operations include  
new row activation, precharge, and refreshing the  
DRAM array. Since new row activations can occur  
during cache read cycles, it is possible for the  
ESDRAM to pipeline random row reads, thus reduc-  
ing the page miss latency to that of a page hit.  
As a JEDEC superset standard, the Enhanced Syn-  
chronous DRAM is an evolutionary modification to a  
JEDEC standard 16Mbit Synchronous DRAM. The  
ESDRAM incorporates changes to a standard  
SDRAM which reduce the latency, increase the  
bandwidth, and allow for concurrent operations to  
the same bank. Even with these improvements in  
performance and functionality, the Enhanced  
SDRAM remains pin and command compatible with  
a JEDEC standard 16Mbit SDRAM. As a result, the  
ESDRAM is plug-compatible with an SDRAM and  
operates like a standard SDRAM when used in an  
SDRAM application.  
This device is designed to comply with all JEDEC  
standards set for SDRAM products, both electrically  
and mechanically. All the control, address, and data  
input/output circuits are synchronized with the posi-  
tive edge of an externally supplied clock.  
Prior to any access operation, the CAS latency,  
burst length, burst sequence, and write caching pol-  
icy must be programmed into the device by address  
inputs A0-A11 during a Mode Register Set com-  
mand cycle. The write policy is set as either Write  
Transfer mode or No Write Transfer mode.  
The 16Mbit Enhanced Synchronous DRAM com-  
bines a fast DRAM array with an 8Kbit SRAM cache.  
The DRAM array is separated into two fully indepen-  
dent 8Mbit DRAM banks with 4Kbits of SRAM cache  
per bank. The SRAM cache is integrated into the  
DRAM array as tightly coupled row registers. The  
integrated cache provides several advantages. The  
first advantage is high speed random column  
accesses (10ns). Another advantage is that through  
the use of auto-precharge, the cache allows the user  
This device supports Self Refresh mode and oper-  
ates with a single 3.3V power supply. The device is  
available in a 400mil TSOP Type II package.  
©1999 Enhanced Memory Systems. All rights reserved.  
Enhanced Memory Systems Inc., 1850 Ramtron Dr., Colo Spgs, CO 80921  
PHONE: (800) 545-DRAM; FAX: (719) 488-9095; http://www.edram.com  
The information contained herein is subject to change without notice.  
Revision 2.1  
Page 1 of 100  

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