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SM130DT-C PDF预览

SM130DT-C

更新时间: 2024-11-13 01:20:27
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2页 305K
描述
Surface Mount Schottky Barrier Rectifiers

SM130DT-C 数据手册

 浏览型号SM130DT-C的Datasheet PDF文件第2页 
SM120DT~SM140DT  
Voltage 20V~40V, 1.0Amp  
Surface Mount Schottky Barrier Rectifiers  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen-free and RoHS Compliant  
FEATURES  
Heatsink Structure  
Low Profile, Typical Thickness 0.8mm  
Moisture Sensitivity: Level 1, Per J-STD-020  
SOD-123DT  
High Temperature Soldering Guaranteed: 260°C/10 Seconds  
MARKING  
PS14  
PACKAGE INFORMATION  
Package  
MPQ  
Leader Size  
SOD-123DT  
3K  
7 inch  
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
2.9  
Max.  
3.1  
Min.  
Max.  
ORDER INFORMATION  
A
B
C
D
E
F
G
H
I
0.85  
1.05  
1.9  
2.1  
0.6 REF.  
Part Number  
Type  
0.75  
3.5  
0.9  
3.9  
0.4  
1.66 REF.  
1.3  
0.85  
1.7  
0.1  
0.25  
J
SM120DT~SM140DT  
Lead (Pb)-free  
SM120DT-C~SM140DT-C  
Lead (Pb)-free and Halogen-free  
1
Cathode  
2
Anode  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
Part Number  
Parameter  
Symbol  
Unit  
SM120DT  
SM130DT  
SM140DT  
Maximum Repetitive Peak Reverse Voltage  
Maximum RMS Voltage  
VRRM  
VRMS  
VDC  
VBR  
IF  
20  
14  
20  
20  
30  
21  
30  
30  
1
40  
28  
40  
40  
V
V
V
V
A
Maximum DC Blocking Voltage  
Minimum Breakdown Voltage @IR=1mA  
Maximum Average Forward Rectified Current  
Peak Forward Surge Current@ 8.3 ms Single Half  
Sine-Wave Superimposed on Rate Load  
IFSM  
I2t  
30  
A
Rating for Fusing (t<8.3ms)  
4
0.5  
0.5  
50  
A2S  
IF=1A, TA=25°C  
IF=1A, TA=75°C  
TA=25°C  
Maximum Instantaneous Forward  
Voltage  
VF  
IR  
V
uA  
mA  
pF  
Maximum DC Reverse Current at  
Rated DC Blocking Voltage  
TA=75°C  
1
Typical Junction Capacitance  
4V, 1MHz  
CJ  
RθJA  
51.2  
65  
Typical Thermal Resistance from Junction to Ambient 1  
Typical Thermal Resistance from Junction to Case 2  
Typical Thermal Resistance from Junction to Lead 1  
Operating Junction and Storage Temperature  
°C/W  
°C  
RθJC  
35  
RθJL  
9
TJ, TSTG  
-55~150  
Notes:  
1.  
The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads, 2 OZ, FR4 PCB.  
The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads, 2 OZ, FR4 PCB.  
2.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
13-Dec-2017 Rev. A  
Page 1 of 2  

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