SM1200DT
Voltage 200V, 1.0 Amp
Surface Mount Schottky Barrier Rectifiers
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen-free and RoHS Compliant
FEATURES
ꢀ
ꢀ
ꢀ
ꢀ
Heatsink structure
Low profile, typical thickness 0.8mm
Moisture sensitivity: level 1, per J-STD-020
SOD-123DT
High temperature soldering guaranteed: 260°C/10 seconds
MARKING
PACKAGE INFORMATION
Package
MPQ
Leader Size
SOD-123DT
3K
7 inch
Millimeter
Millimeter
REF.
REF.
ORDER INFORMATION
Part Number
Min.
Max.
Min.
Max.
A
B
C
D
E
2.9
1.9
3.1
2.1
F
G
H
I
0.85
1.05
Type
0.6 REF.
0.75
3.5
0.9
3.9
0.4
1.66 REF.
1.3
0.85
1.7
SM1200DT
Lead (Pb)-free
Lead (Pb)-free and Halogen-free
0.1
0.25
J
SM1200DT-C
1
Cathode
2
Anode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Parameter
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Symbol
VRRM
VRMS
VDC
Rating
200
140
200
200
1
Unit
V
V
Maximum DC Blocking Voltage
V
Minimum Breakdown Voltage @IR=1mA
Maximum Average Forward Rectified Current
VBR
V
IF
A
Peak Forward Surge Current@ 8.3 ms single half sine-wave
Superimposed on rate load
IFSM
40
A
V
IF=0.5A
Maximum Instantaneous Forward Voltage
IF=1A
0.8
0.85
2
VF
TA=25°C
Maximum DC Reverse Current at Rated DC
IR
uA
Blocking Voltage
TA=125°C
200
65
Typical Thermal Resistance from Junction to Ambient 1
Typical Thermal Resistance from Junction to Case 2
Typical Thermal Resistance from Junction to Lead 1
RθJA
RθJC
°C / W
°C
35
RθJL
9
Operating Junction and Storage Temperature
Notes:
TJ, TSTG
-55~150
1. The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB.
2. The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
31-Jul-2018 Rev. A
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