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SLD8S PDF预览

SLD8S

更新时间: 2022-02-26 13:26:01
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
6页 1127K
描述
The SLD8S Series is SMTO-263 packaged with leaded modification and is designed to provide precision overvoltage protection for sensitive electronics

SLD8S 数据手册

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•ꢀ  
•ꢀ  
                                                                
IEC-61000-4-2ꢀESDꢀ  
30kV(Air),ꢀ30kVꢀ(Contact)  
ESDꢀprotectionꢀofꢀdataꢀ  
lines in accordance with  
IECꢀ61000-4-2ꢀꢀ  
                                                                
•ꢀ  
                                                                
EFTꢀprotectionꢀofꢀdataꢀ  
lines in accordance with  
IECꢀ61000-4-4ꢀꢀ  
                                                                                      
TVS Diodes  
Surface Mount – SLD8S series  
Pb e3  
RoHS  
SLD8S Series  
Description  
The SLD8S Series is SMTO-263 packaged with leaded  
modification and is designed to provide precision  
overvoltage protection for sensitive electronics.  
Features  
•ꢀ AEC-Q101ꢀqualifiedꢀ  
•ꢀ SMTO-263ꢀpackage,ꢀandꢀ  
•ꢀ Excellentꢀclampingꢀ  
capability  
foot print is compatible to •ꢀ Lowꢀincrementalꢀsurgeꢀ  
industrial popular DO-  
218AB package  
resistance  
•ꢀ Plasticꢀpackageꢀisꢀ  
•ꢀ MeetꢀISO7637-2ꢀ5a/5bꢀ  
protectionꢀandꢀISO16750ꢀ  
load dump test (refer to  
APP note for details)  
flammabilityꢀratedꢀV-0ꢀperꢀ  
Underwriters Laboratories  
•ꢀMeetꢀMSLꢀlevelꢀ1,ꢀperꢀ  
Agency Approvals  
J-STD-020,ꢀLFꢀmaximunꢀ  
•ꢀ VBR @TJ=ꢀVBR@25°C  
x (1+αT x (TJ - 25))  
(αT:Temperature  
Coefficient,ꢀtypicalꢀvalueꢀisꢀ  
0.1%  
•ꢀ Glassꢀpassivatedꢀchipꢀ  
junction in modifiedTO-  
263 package  
peak of 260°C  
AGENCY  
AGENCY FILE NUMBER  
E230531  
•ꢀ Forꢀsurfaceꢀmountedꢀ  
applications to optimize  
board space  
•ꢀLowꢀprofileꢀpackage  
Maximum Ratings andThermal Characteristics  
(TA=25OC unless otherwise noted)  
•ꢀ Highꢀtemperatureꢀ  
to reflow soldering  
guaranteed:ꢀ260°C/10secꢀ  
at terminals  
•ꢀ Matteꢀtinꢀlead–freeꢀplated  
•ꢀHalogenꢀfreeꢀandꢀRoHSꢀ  
Parameter  
Symbol  
Value  
Unit  
W
Peak Pulse Power Dissipation  
1. 10ms x 150ms test waveform  
2200  
PPPM  
2. 10µs x 1000µs test waveform  
7000  
W
W
compliant  
Power dissipation on infinite  
heatsink atTC = 25 °C  
•ꢀPb-freeꢀE3ꢀmeansꢀ2ndꢀ  
level interconnect is Pb-  
free and the terminal finish  
materialꢀisꢀtinꢀ(Sn)ꢀ(IPC/  
JEDEC J-STD-609A.01)  
PD  
VF  
8.0  
Maximum Instantaneous Forward  
Voltageꢀatꢀ100AꢀforꢀUnidirectionalꢀ  
only  
1.8  
V
•ꢀ Fastꢀresponseꢀtime:ꢀ  
typicallyꢀlessꢀthanꢀ1.0psꢀ  
fromꢀ0ꢀVoltsꢀtoꢀBVꢀmin  
Peak forward surge current 8.3m  
single half sine-wave  
IFSM  
1000  
A
°C  
Operating Junction and Storage  
Temperature Range  
TJ,ꢀTSTG -55ꢀtoꢀ175  
TypicalThermalꢀResistanceꢀJunctionꢀ  
to case  
RθJC  
0.9  
°C/W  
Applications  
Functional Diagram  
Designed to protect sensitive electronics from:  
Cathode  
- Inductive Load Switching  
- Alternator Load Dump  
Anode  
Uni-directional  
©2016 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 08/24/16  

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