是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | ROHS COMPLIANT, PACKAGE-2 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 8.61 |
JESD-30 代码: | O-XDSS-W2 | JESD-609代码: | e3 |
功能数量: | 1 | 端子数量: | 2 |
最高工作温度: | 90 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装形状: | ROUND |
封装形式: | SPECIAL SHAPE | 峰值回流温度(摄氏度): | 260 |
表面贴装: | NO | 电信集成电路类型: | SURGE PROTECTION CIRCUIT |
温度等级: | INDUSTRIAL | 端子面层: | TIN |
端子形式: | WIRE | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
2027-09-BLF | BOURNS |
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