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SKT7

更新时间: 2024-11-30 09:23:59
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赛米控丹佛斯 - SEMIKRON /
页数 文件大小 规格书
2页 168K
描述
THYRISTOR

SKT7 数据手册

 浏览型号SKT7的Datasheet PDF文件第2页 
SKT 7,0 Qu RG bond.  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
Tj = 25 °C, IR = 0.2 mA  
VRRM  
VDRM  
IT(AV)  
ITSM  
i2t  
1600  
1600  
55  
V
V
Tj = 25 °C, ID = 0.2 mA  
Tc = 80 °C, Tj = 130 °C  
A
Tj = 130 °C, 10 ms, sin 180°  
Tj = 130 °C, 10 ms, sin 180°  
450  
A
A2s  
1010  
130  
Tjmax  
°C  
THYRISTOR  
Electrical Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
IT(DC) = 75 A  
Tj = 130 °C, IT = 45 A  
Tj = 130 °C  
Tj = 130 °C  
Tj = 25 °C  
VT  
1.2  
0.85  
7.9  
V
V
VRRM = 1600 V  
VT(TO)  
rT  
Size: 7,0 mm x 7,0 mm  
m  
mA  
V
IGT  
VGT  
IGD  
VGD  
IH  
100  
1.98  
Corner gate  
Tj = 25 °C  
SKT 7,0 Qu RG bond.  
Tj = 115 °C  
Tj = 130 °C  
Tj = 25 °C  
6
mA  
V
0.25  
165  
330  
mA  
mA  
Features  
• high current density due to double  
mesa technology  
Tj = 25 °C  
IL  
• high surge current  
Dynamic Characteristics  
Symbol Conditions  
• compatible to thick wire bonding  
• compatible to all standard solder  
processes  
min.  
typ.  
max.  
Unit  
Tj = 130 °C  
Tj = 130 °C  
Tj = 130 °C  
tq  
150  
µs  
Typical Applications*  
• conrolled rectifier circuits  
• solid state relays  
(di/dt)cr  
(dv/dt)cr  
50  
A/µs  
V/µs  
1000  
Thermal Characteristics  
Symbol Conditions  
min.  
typ.  
max.  
Unit  
Tj  
-40  
-40  
130  
130  
255  
°C  
°C  
Tstg  
Tsolder  
°C  
Rth(j-c)  
Semipack 1 assembly  
0.45  
K/W  
Mechanical Characteristics  
Symbol Conditions  
Values  
Unit  
Raster  
size  
7.0 x 7.0  
49  
mm2  
mm2  
Area total  
Anode  
solderable (Ag/Ni)  
Gate and  
Cathode  
bondable (Al)  
Wire bond  
Package  
Al,diameter 500µm  
tray  
Chips /  
Package  
81  
pcs  
SKT  
© by SEMIKRON  
Rev. 0 – 19.02.2010  
1

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