SKT 12,4 Qu RG bond.
Absolute Maximum Ratings
Symbol Conditions
Values
Unit
Tj = 25 °C, IR = 0.45 mA
VRRM
VDRM
IT(AV)
ITSM
i2t
1600
1600
130
V
V
Tj = 25 °C, ID = 0.45 mA
Tc = 80 °C, Tj = 130 °C
A
Tj = 130 °C, 10 ms, sin 180°
Tj = 130 °C, 10 ms, sin 180°
1800
16200
130
A
A2s
Tjmax
°C
THYRISTOR
Electrical Characteristics
Symbol Conditions
min.
typ.
max.
Unit
IT(DC) = 165 A
Tj = 130 °C, IT = 165 A
VT
1.2
0.85
2.2
V
V
VRRM = 1600 V
Tj = 130 °C
Tj = 130 °C
Tj = 25 °C
Tj = 25 °C
Tj = 115 °C
Tj = 130 °C
Tj = 25 °C
Tj = 25 °C
VT(TO)
rT
Size: 12,4 mm x 12,4 mm
mΩ
mA
V
IGT
VGT
IGD
VGD
IH
100
1.98
Corner gate
SKT 12,4 Qu RG bond.
6
mA
V
0.25
220
550
mA
mA
Features
• high current density due to double
mesa technology
IL
• high surge current
Dynamic Characteristics
Symbol Conditions
• compatible to thick wire bonding
• compatible to all standard solder
processes
min.
typ.
max.
Unit
Tj = 130 °C
Tj = 130 °C
Tj = 130 °C
tq
150
µs
Typical Applications*
• conrolled rectifier circuits
• solid state relays
(di/dt)cr
(dv/dt)cr
100
A/µs
V/µs
1000
Thermal Characteristics
Symbol Conditions
min.
typ.
max.
Unit
Tj
-40
-40
130
130
255
°C
°C
Tstg
Tsolder
°C
Rth(j-c)
Semipack 1 assembly
0.25
K/W
Mechanical Characteristics
Symbol Conditions
Values
Unit
Raster
size
12.4 x 12.4
153.8
mm2
mm2
Area total
Anode
solderable (Ag/Ni)
Gate and
Cathode
bondable (Al)
Wire bond
Package
Al,diameter ≤ 500µm
tray
Chips /
Package
36
pcs
SKT
© by SEMIKRON
Rev. 0 – 19.02.2010
1