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SKCD42C060IHD_10 PDF预览

SKCD42C060IHD_10

更新时间: 2024-11-14 09:24:27
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赛米控丹佛斯 - SEMIKRON 二极管
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2页 169K
描述
CAL-DIODE

SKCD42C060IHD_10 数据手册

 浏览型号SKCD42C060IHD_10的Datasheet PDF文件第2页 
SKCD 42 C 060 I HD  
Absolute Maximum Ratings  
Symbol Conditions  
Values  
Unit  
Tj = 25 °C, IR = 0.2 mA  
Ts = 80 °C, Tj = 175 °C  
VRRM  
IF(AV)  
IFSM  
600  
75  
V
A
Tj = 25 °C  
Tj = 150 °C  
985  
810  
175  
A
10 ms  
sin 180°  
A
Tjmax  
°C  
Electrical Characteristics  
Symbol Conditions  
CAL-DIODE  
min.  
typ.  
max.  
Unit  
IF = 100 A  
i2t  
IR  
3281  
0.20  
A2s  
mA  
mA  
V
Tj = 150 °C, 10 ms, sin 180°  
Tj = 25 °C, VRRM = 600 V  
VRRM = 600 V  
Tj = 150 °C, VRRM = 600 V  
Tj = 25 °C, IF = 110 A  
Tj = 150 °C, IF = 110 A  
Tj = 150 °C  
Size: 6,48 mm x 6,48 mm  
VF  
1.35  
1.31  
0.85  
4.2  
V
V(TO)  
rT  
V
SKCD 42 C 060 I HD  
Tj = 150 °C  
m  
Dynamic Characteristics  
Symbol Conditions  
Features  
• high current density  
min.  
typ.  
max.  
Unit  
• easy paralleling due to a small forward  
voltage spread  
• positive temperature coefficient  
• very soft recovery behavior  
• small switching losses  
• high ruggedness  
• compatible to thick wire bonding  
• compatible to standard solder  
processes  
Tj = 25 °C, 100 A, 300 V, 1300 A/µs  
trr  
µs  
ns  
µC  
µC  
A
Tj = 150 °C, 100 A, 300 V, 1300 A/µs  
Tj = 25 °C, 100 A, 300 V, 1300 A/µs  
Tj = 150 °C, 100 A, 300 V, 1300 A/µs  
Tj = 25 °C, 100 A, 300 V, 1300 A/µs  
Tj = 150 °C, 100 A, 300 V, 1300 A/µs  
trr  
Qrr  
Qrr  
Irrm  
Irrm  
14  
67  
A
Thermal Characteristics  
Symbol Conditions  
Typical Applications*  
• freewheeling diode for IGBT  
min.  
typ.  
max.  
Unit  
Tj  
-40  
-40  
175  
175  
250  
320  
°C  
°C  
°C  
°C  
Tstg  
Tsolder  
Tsolder  
10 min.  
5 min.  
sold. on 0,38 mm DCB, reference point  
on copper heatsink close to the chip  
Rth(j-s)  
0.78  
K/W  
Mechanical Characteristics  
Symbol Conditions  
Values  
Unit  
Raster  
size  
6.48 x 6.48  
mm2  
mm2  
Area total  
Anode  
41.99  
bondable (Al)  
Cathode  
Wire bond  
Package  
solderable (Ag/Ni)  
Al, diameter 500 µm  
wafer frame  
Chips /  
Package  
234 (5" Wafer)  
pcs  
SKCD  
© by SEMIKRON  
Rev. 0 – 18.02.2010  
1

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