SGT6920NH
6.8 A, 20 V, RDS(ON) 22 mΩ
Dual-N Enhancement Mode MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
TSSOP-8
DESCRIPTION
These miniature surface mount MOSFETs utilize a High
A
Cell Density trench process to provide Low RDS(on) and ensure
minimal power loss and heat dissipation. Typical applications
are DC-DC converters and power management in portable and
battery-powered products such as computers, printer , PCMCIA
cards, cellular and cordless telephones.
D
B
J
FEATURES
ꢀ
Low RDS(on) provides higher efficiency and extends
battery life.
H
F
G
E
K
C
ꢀ
Low thermal impedance copper leadframe TSSOP-8
saves board space.
L
ꢀ
ꢀ
Fast switching speed.
High performance trench technology.
Millimeter
Millimeter
REF.
REF.
Min.
Max.
3.10
6.60
1.20
4.50
1.15
1.10
Min.
0.45
0.19
Max.
0.75
0.30
A
B
C
D
E
F
2.80
6.20
1.00
4.30
-
G
H
J
K
L
0.65 REF.
0.05
0.15
0.127 REF
PACKAGE INFORMATION
0.9
Package
MPQ
3K
Leader Size
Top View
TSSOP-8L
13’ inch
ABSOLUTE MAXIMUM RATINGS(TA=25°C unless otherwise specified)
Parameter
Symbol
Rating
20
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
V
±8
6.8
TA=25°C
TA=70°C
A
Continuous Drain Current 1
ID
5.4
A
Pulsed Drain Current 2
IDM
IS
A
30
Continuous Source Current (Diode Conduction) 1
Power Dissipation 1
1.5
1.2
0.8
A
TA=25°C
TA=70°C
W
W
°C
PD
Operating Junction and Storage Temperature Range
TJ, TSTG
-55 ~ 150
Thermal Resistance Rating
t ≦ 10 sec
83
Maximum Junction to Ambient 1
Notes:
Rθ
JA
°C / W
Steady State
120
1
2
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
23-Jan-2013 Rev. A
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