SGM48523C
SGM48524C
Dual 5A, High-Speed, Low-Side Gate Drivers
with Negative Input Voltage Capability
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
SGM
48523CXS8
XXXXX
SGM03G
XPMS8
XXXXX
SGM
03DDB
XXXXX
SGM
48524CXS8
XXXXX
SGM03E
XPMS8
XXXXX
SGM
SOIC-8
SGM48523CXS8G/TR
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 4000
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
MSOP-8
(Exposed Pad)
SGM48523C
SGM48523CXPMS8G/TR
SGM48523CXTDB8G/TR
SGM48524CXS8G/TR
TDFN-3×3-8L
SOIC-8
MSOP-8
(Exposed Pad)
SGM48524C
SGM48524CXPMS8G/TR
SGM48524CXTDB8G/TR
TDFN-3×3-8L
03BDB
XXXXX
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code.
X X X X X
Vendor Code
Trace Code
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
VDD................................................................... -0.3V to 20V
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Continuous INA, INB when (VDD - VINx) ≤ 20V
..................................................................-10V to VDD + 0.3V
Continuous ENA, ENB when (VDD - VENx) ≤ 20V
..................................................................-10V to VDD + 0.3V
Continuous OUTA, OUTB (DC) ...............-0.3V to VDD + 0.3V
Pulse OUTA, OUTB (Pulse < 200ns)..........-2V to VDD + 0.3V
Package Thermal Resistance
ESD SENSITIVITY CAUTION
SOIC-8, θJA .............................................................. 121℃/W
MSOP-8 (Exposed Pad), θJA...................................... 55℃/W
TDFN-3×3-8L, θJA...................................................... 70℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................7000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range.........................................8.5V to 18V
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
OCTOBER 2022
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