11A High-Speed
SGM48510
Low-Side MOSFET Driver
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
MBZ
XXXX
SGM
48510XS8
XXXXX
TDFN-2×2-8AL
SOIC-8
SGM48510XTDE8G/TR
Tape and Reel, 3000
Tape and Reel, 4000
-40℃ to +125℃
SGM48510
SGM48510XS8G/TR
-40℃ to +125℃
MARKING INFORMATION
NOTE: XXXX = Date Code, Trace Code and Vendor Code. XXXXX = Date Code, Trace Code and Vendor Code.
TDFN-2×2-8AL
SOIC-8
X X X X X
Serial Number
Y Y Y
X X X X
Vendor Code
Trace Code
Vendor Code
Trace Code
Date Code - Year
Date Code - Year
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
OVERSTRESS CAUTION
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
Supply Voltage, VDD........................................... -0.3V to 28V
Output Current (DC), IOUT_DC...........................................0.6A
Output Current (1), IOUT_PULSE ............................................11A
Input Voltages, VIN+, VIN- ....................................... -6V to 24V
Output Voltages, VOUTH, VOUTL .................-0.3V to VDD + 0.3V
Output Voltages (Pulse < 0.5µs), VOUTH, VOUTL
.................................................................-3.0V to VDD + 3.0V
Package Thermal Resistance
ESD SENSITIVITY CAUTION
TDFN-2×2-8AL, θJA.................................................... 63℃/W
SOIC-8, θJA .............................................................. 131℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................3000V
CDM ............................................................................1000V
RECOMMENDED OPERATING CONDITIONS
Supply Voltage, VDD.............................................4.5V to 24V
Input Voltages, VIN+, VIN- ....................................... -5V to 24V
Operating Junction Temperature Range......-40℃ to +125℃
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
NOTE:
1. A 1μF load is connected from OUT (OUTH shorted to
OUTL) to GND with 1kHz square wave input.
SG Micro Corp
www.sg-micro.com
DECEMBER 2022
2