Datasheet > SGM48211

SGM48211

更新时间： 2024-04-09 18:59:46

品牌	Logo	应用领域
圣邦微 - SGMICRO		/
页数	文件大小	规格书
19页	737K
描述
120V Boot, 4A Peak, High Frequency High-side and Low-side Driver

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SGM48211 数据手册

120V Boot, 4A Peak, High Frequency

High-side and Low-side Driver

SGM48211

PIN DESCRIPTION

NAME

I/O

FUNCTION

Positive Supply of the Whole Driver. A decoupling capacitor in the range of 0.22µF to 4.7µF is

connected between VDD and VSS pins. ⁽¹⁾

VDD

High-side Bootstrap Supply. A bootstrap capacitor in the range of 0.022µF to 0.1µF is

connected between HB and HS pins. The capacitor value varies with total gate charge of

external MOSFET, the switching speed, as well as the voltage ripple criteria.

Output of the High-side Driver. Connect this pin to the gate of the high-side MOSFET.

Reference Ground of the High-side Output Stage. Tie this pin directly to the source of external

high-side power MOSFET.

Input of the High-side Driver. ⁽²⁾

Input of the Low-side Driver. ⁽²⁾

VSS

—

Reference Ground of the Device.

Output of the Low-side Driver. Connect this pin to the gate of the low-side MOSFET.

Exposed

Pad ⁽³⁾

Thermal Pad. Connect directly to VSS with a large wide trace or polygon copper to achieve

improved thermal conduction.

NOTES:

1. It is recommended to use the upper capacitance range for low temperature consideration.

2. Capacitors with typical value of 1nF to 10nF are recommended to be placed between HI/LI and VSS pins, which will be a great

help to filter noise presented on these pins.

3. The exposed pad is internally connected to the substrate for thermal conduction and should be connected to the ground

outside.

SG Micro Corp

www.sg-micro.com

DECEMBER 2023

1 2 345 6 7...19

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