Datasheet > SGA-9189

SGA-9189

更新时间： 2024-01-04 22:14:20

品牌	Logo	应用领域
STANFORD		射频微波
页数	文件大小	规格书
5页	451K
描述
Reliability Qualification Report

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技术参数
数据手册

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SGA-9189 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	compliant	ECCN代码：	5A991.G
HTS代码：	8542.33.00.01	风险等级：	5.12
Is Samacsys：	N	特性阻抗：	50 Ω
构造：	COMPONENT	增益：	11.2 dB
JESD-609代码：	e3	最大工作频率：	3000 MHz
最小工作频率：	50 MHz	最高工作温度：	85 °C
最低工作温度：	-40 °C	射频/微波设备类型：	WIDE BAND MEDIUM POWER
端子面层：	Matte Tin (Sn)	Base Number Matches：	1

SGA-9189 数据手册

SGA-9189 Reliability Qualification Report

Operational and Accelerated Life Testing

The purpose of the operational life test is to statistically show that the product operated at

125^oC will be reliable. This is accomplished by operating several hundred devices for a

total test time of 1000 hours. The results for this test are expressed in device hours which

are calculated by multiplying the total number of devices passing by the number of hours

tested.

Operational Life Test Results

The results for SGA-9189 High Temperature Operating Life Test are as follows:

Group

Test Time Quantity Quantity

Out

Device

Hours

(hours)

1000

189

189,000

Table 2: High Temperature Operational Life Test Results

Accelerated Life Test Results

The following data demonstrates the results from accelerated life tests performed on the

Stanford 4A SiGe HBT Process. The test was performed on 77 units running at a peak

junction temperature of 195^oC. The test exceeded 10,000 hours (1.14 years) with no

failures. The FIT rate / MTTF calculation can be found below. The FIT rates were

generated assuming 1 failure. In reality, there were no failures, making this a very

conservative calculation.

Stanford Microdevices Process 4ASiGe HBT

FIT Rate / MTTF Calculation

SGA Series Devices

Parameters

*Ea = 0.7 eV

Junction Temp C FIT Rate MTTF (hrs)

125

0.053

4.136

1.89E+10

2.42E+08

*The Ea of 0.7eV is conservative, 0.85eV is the activation energy for electomigration which is assumed to be the primary failure mechanism for

the SiGe process.

**Stanford Microdevices does not assume any liability arising from the use of this data.

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