是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | TO-66 |
包装说明: | HERMETIC SEALED, METAL CAN, TO-66, 9 PIN | 针数: | 2 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.27 |
Is Samacsys: | N | 高边驱动器: | YES |
接口集成电路类型: | BUFFER OR INVERTER BASED MOSFET DRIVER | JESD-30 代码: | O-MBFM-P9 |
JESD-609代码: | e0 | 功能数量: | 2 |
端子数量: | 9 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 标称输出峰值电流: | 3 A |
封装主体材料: | METAL | 封装代码: | TO-66 |
封装等效代码: | CAN9/10,.33FL | 封装形状: | ROUND |
封装形式: | FLANGE MOUNT | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 4.5/20 V | 认证状态: | Not Qualified |
筛选级别: | MIL-STD-883 | 子类别: | MOSFET Drivers |
最大供电电压: | 20 V | 最小供电电压: | 4.5 V |
标称供电电压: | 15 V | 表面贴装: | NO |
技术: | BIPOLAR | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | PIN/PEG |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
断开时间: | 0.05 µs | 接通时间: | 0.04 µs |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SG1644T | MICROSEMI |
获取价格 |
DUAL HIGH SPEED DRIVER | |
SG1644T/883B | MICROSEMI |
获取价格 |
DUAL HIGH SPEED DRIVER | |
SG1644T/DESC | MICROSEMI |
获取价格 |
DUAL HIGH SPEED DRIVER | |
SG1644Y | MICROSEMI |
获取价格 |
DUAL HIGH SPEED DRIVER | |
SG1644Y | MICROCHIP |
获取价格 |
The SG1644 is a dual non-inverting monolithic high speed driver. This device utilizes hig | |
SG1644Y/883B | MICROSEMI |
获取价格 |
DUAL HIGH SPEED DRIVER | |
SG1644Y/DESC | MICROSEMI |
获取价格 |
DUAL HIGH SPEED DRIVER | |
SG1644Y-DESC | MICROSEMI |
获取价格 |
暂无描述 | |
SG16AA | SANREX |
获取价格 |
THYRISTOR MODULE (ISOLATED MOLD TYPE) | |
SG16AA20 | SANREX |
获取价格 |
THYRISTOR MODULE (ISOLATED MOLD TYPE) |