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SFP9Z14 PDF预览

SFP9Z14

更新时间: 2024-11-17 22:21:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
7页 252K
描述
Advanced Power MOSFET

SFP9Z14 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:TO-220, 3 PIN
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.36
Is Samacsys:N雪崩能效等级(Eas):115 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):6.7 A最大漏极电流 (ID):6.7 A
最大漏源导通电阻:0.5 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT APPLICABLE极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):38 W最大脉冲漏极电流 (IDM):27 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT APPLICABLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SFP9Z14 数据手册

 浏览型号SFP9Z14的Datasheet PDF文件第2页浏览型号SFP9Z14的Datasheet PDF文件第3页浏览型号SFP9Z14的Datasheet PDF文件第4页浏览型号SFP9Z14的Datasheet PDF文件第5页浏览型号SFP9Z14的Datasheet PDF文件第6页浏览型号SFP9Z14的Datasheet PDF文件第7页 
SFP9Z14  
Advanced Power MOSFET  
FEATURES  
BVDSS = -60 V  
RDS(on) = 0.5   
ID = -6.7 A  
n Avalanche Rugged Technology  
n Rugged Gate Oxide Technology  
n Lower Input Capacitance  
n Improved Gate Charge  
n 175oC Opereting Temperature  
n Extended Safe Operating Area  
n Lower Leakage Current : -10 µA (Max.) @ VDS = -60V  
n Low RDS(ON) : 0.362 (Typ.)  
TO-220  
1
2
3
1.Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Value  
-60  
Units  
VDSS  
Drain-to-Source Voltage  
V
Continuous Drain Current (TC=25oC)  
Continuous Drain Current (TC=100oC)  
Drain Current-Pulsed  
-6.7  
-4.7  
-27  
ID  
A
IDM  
VGS  
EAS  
IAR  
1
A
V
O
2
Gate-to-Source Voltage  
±30  
115  
-6.7  
3.8  
O
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
1
O
1
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Total Power Dissipation (TC=25oC)  
Linear Derating Factor  
mJ  
V/ns  
W
O
3
-5.5  
38  
O
PD  
TJ , TSTG  
TL  
0.25  
W/oC  
Operating Junction and  
- 55 to +175  
300  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
oC  
Purposes, 1/8” from case for 5-seconds  
Thermal Resistance  
Symbol  
RθJC  
Characteristic  
Junction-to-Case  
Case-to-Sink  
Typ.  
Max.  
3.95  
--  
Units  
--  
0.5  
--  
oC/W  
RθCS  
RθJA  
Junction-to-Ambient  
62.5  
Rev. C  

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