SFC2282-50
ChipClampΤΜ
Flip Chip TVS Diode with T-Filter
PRELIMINARY
PROTECTION PRODUCTS
Features
Description
The SFC2282-50 is a low pass T-filter with integrated
TVS diodes. It is designed to provide bidirectional
filtering of EMI/RFI signals and electrostatic discharge
(ESD) protection in portable electronic equipment. This
state-of-the-art device utilizes solid-state silicon-
avalanche technology for superior clamping perfor-
mance and DC electrical characteristics.
Flip Chip bidirectional EMI/RFI filter with
integrated ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level4,
+/-15kV (air), +/-8kV (contact)
Filter performance: attenuation 100MHz to 3GHz
Small chip scale package requires less board space
Low profile (< 0.65mm)
No need for underfill material
Each device will protect two data or I/O lines. The
device has very low insertion loss in the pass band (to
approximately 10MHz) and good attenuation at high
frequencies (approximately 100MHz to 3GHz). Each
line features two stages of TVS diode protection. The
TVS diodes form a voltage divider with the series
resistor. The voltage divider action of the circuit limits
the voltage across the protected IC to very close to the
breakdown voltage (VBR) of the second TVS. The TVS
diodes provide effective suppression of ESD voltages
in excess of 15kV (air discharge) and 8kV (contact
discharge) per IEC 61000-4-2, level 4. The flip chip
design results in lower inductance, virtually eliminating
voltage overshoot due to leads and interconnecting
bond wires.
Maximum Dimensions: 1.5 x 1.0 x 0.65 mm
Protection and filtering for two lines
Working voltage: 5V
Solid-state technology
Mechanical Characteristics
JEDEC MO-211, Variation BB, 0.50 mm Pitch Chip
Scale Package (CSP)
Marking : Marking Code + Chevron
Packaging : Tape and Reel
Applications
Cell Phone Handsets and Accessories
Personal Digital Assistants (PDA’s)
Notebook & Hand Held Computers
Portable Instrumentation
Pagers
Smart Cards
MP3 Players
GPS
The SFC2282-50 is a 6-bump, 0.5mm pitch flip chip
array with a 3x2 bump grid. It measures 1.5 x 1.0 x
0.65mm. This small outline makes the SFC2282-50
especially well suited for portable applications. They
are compatible with current pick and place equipment
and assembly methods.
Circuit Diagram (Each Line)
Schematic & PIN Configuration
LOW PASS FILTER
3 x 2 Grid CSP TVS (Bottom View)
www.semtech.com
Revision 01/17/2002
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