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SEP8MA4001 PDF预览

SEP8MA4001

更新时间: 2024-11-13 10:10:35
品牌 Logo 应用领域
急速微 - ALLEGRO /
页数 文件大小 规格书
14页 492K
描述
Triple Color LED, Red/green/blue, White, 13.3mm, 13.70 X 5.23 MM, LEAD FREE, SURFACE MOUNT PACKAGE-16

SEP8MA4001 数据手册

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SEPM Series  
RGB Multi Chip LED Modules  
Features and Benefits  
Description  
High efficiency, 50 1m/W with all LEDs illuminated;  
equivalent to CCFLs  
Low thermal resistance, RθJC = 6°C/W  
High optical output, 25 lm, with all LEDs illuminated  
Superior directivity  
5.23 mm × 13.7 mm case footprint, and  
low 2.5-mm overall package height  
Silver-plated leadframe  
The SEPM series of LEDs provides a range of high-powered  
AlGaInP red (λD = 616 nm), and InGaN green (523 nm) and  
blue (461 nm) LEDs that can be used in general lighting  
applications, amusement and gaming equipment, and for  
backlighting TFT displays. Each module combines 8 LED  
chips in 4 separate channels.  
ModulardesignallowstheSEPMdevicestobeeasilyassembled  
into string arrays by simply connecting the modules in series.  
The devices also provide superior color balance throughout  
the display because of the high density of LEDs that can be  
achieved. This also minimizes the distance that power and  
control lines must run between LEDs and from the LEDs to  
the control electronics.  
LED array of 8 RGB chips  
Package:  
16-pin, 1.27-mm pitch, surface mount  
The white thermoplastic case is an innovative Sanken original  
design with exceptional heat dissipation properties. The white  
resincompoundisespeciallyformulatedforsuperiorreflectance  
and transmittance of the generated light. Enhanced thermal  
dissipationisachievedthroughtheincorporatedheatsinkonthe  
bottomofthepackage.Theheatsinkcanbemateddirectlytoan  
externalradiatorthroughthePCBforsuperiorheatconduction  
allowing dense placement of modules.  
Theleadframeisplatedwithsilver,providingahighly-reflective  
surface for the bottom and sides of the emitting area. The  
terminals and heatsink are also silver-plated.  
Not to scale  
Typical Application  
VB  
L1  
D1  
5 to 20 V 10 μH  
8 SEPM modules, 8 LEDs each  
1 μF  
36 V  
CO  
2.2μF/50V  
SEP8Mx  
SEP8Mx  
SEP8Mx  
SEP8Mx  
SEP8Mx  
SEP8Mx  
SEP8Mx  
SEP8Mx  
SW SW OVP  
SEL1  
LED1  
LED2  
LED3  
LED4  
LED5  
LED6  
LED7  
LED8  
The SEPM devices can be mounted in tight  
arrays on a single PCB substrate for ease of  
manufacture and to provide a dense, uniform  
appearance when illuminated.  
SEL2  
SEL3  
Allegro  
A8500  
VIN  
0.1 μF  
10 V  
5 V  
LED Driver  
IC  
The application shown here uses eight  
SEP8Mx LED modules, each populated by  
eight LEDs connected in series. Different  
combinations of LEDs can be placed in the  
modules  
EN  
PWM  
APWM  
SKIP  
COMP  
FSET  
ISET  
AGND PGND  
48101.001, Rev. 3  

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