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SEAMP-40-02.0-S-08 PDF预览

SEAMP-40-02.0-S-08

更新时间: 2024-11-07 20:51:47
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 506K
描述
Board Connector, 320 Contact(s), 8 Row(s), Male, Straight, Press Fit Terminal,

SEAMP-40-02.0-S-08 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:compliant
Factory Lead Time:2 weeks风险等级:5.48
连接器类型:BOARD CONNECTOR联系完成配合:GOLD (30) OVER NICKEL (50)
联系完成终止:Matte Tin (Sn) - with Nickel (Ni) barrier触点性别:MALE
触点材料:COPPER ALLOYDIN 符合性:NO
滤波功能:NOIEC 符合性:NO
JESD-609代码:e3MIL 符合性:NO
混合触点:NO安装方式:STRAIGHT
安装类型:BOARD装载的行数:8
选件:GENERAL PURPOSE端子节距:1.27 mm
端接类型:PRESS FIT触点总数:320
Base Number Matches:1

SEAMP-40-02.0-S-08 数据手册

  
SEAMP–20–02.0–L–06  
F-215  
SEAMI–50–11.0–L–10–2–A–K–TR  
Press fit  
tails  
(1,27 mm) .050"  
SEAMP, SEAMI SERIES  
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD  
Mates with:  
NO. OF POSITIONS  
PER ROW  
PLATING  
OPTION  
NO. OF  
ROWS  
SEAF, SEAF-RA-GP  
OPTION  
SEAMP  
02.0  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAMP  
–L  
04  
GP  
= Guide  
Post  
(Mates with  
SEAF-RA-  
GP only)  
= 10 µ" (0,25 µm)  
Gold on  
= Four Rows  
Insulator Material: Natural LCP  
Contact Material: Copper Alloy  
Operating Temp Range:  
-55°C to +125°C  
SEAMP  
–10, 20, 30, –40, –50  
= Press Fit  
contact area,  
Matte Tin on tail  
06  
No. of positions x  
(1,27) .050 + (5,18) .204  
= Six Rows  
Current Rating: 2.5 A per pin  
(6 adjacent pins powered)  
Plating: Au or Sn over  
NO. OF  
A
B
ROWS  
–S  
08  
(7,06) (2,54)  
.278 .100  
(9,60) (2,54)  
.378 .100  
(12,14) (5,08)  
.478 .200  
(14,68) (7,62)  
.578 .300  
= 30 µ" (0,76 µm)  
Gold on  
TR  
= Tape  
& Reel  
–04  
–06  
–08  
–10  
= Eight Rows  
50 µ" (1,27 µm) Ni  
A
Contact Resistance: 8.7 mΩ  
Working Voltage: 215 VAC  
RoHS Compliant: Yes  
B
contact area,  
Matte Tin on tail  
10  
= Ten Rows  
(1,27) .050  
RECOGNITIONS  
For complete scope  
of recognitions see  
SEAMP/SEAF-RA  
Single-Ended Signaling  
Differential Pair Signaling  
*Test board losses de-embedded from performance data.  
Complete test data available at www.samtec.com?SEAMP  
or contact sig@samtec.com  
Processing: Application tooling and one ton  
minimum press required. Contact ATG@samtec.com  
for more information.  
Rated @ 3dB Insertion Loss*  
11 GHz / 22 Gbps  
MATED HEIGHTS*  
11 GHz / 22 Gbps  
(4,60)  
.181  
www.samtec.com/quality  
SEAMPSEAF LEAD STYLE  
LEAD  
–05.0 –06.0 –06.5  
STYLE  
(0,59) .023  
(1,23)  
7 mm 8 mm 8.5 mm  
–02.0  
(1,78)  
.070  
No. of positions x  
.048  
Note: Compliant pin fixture *Processing conditions will  
(1,27) .050 - (1,27) .050  
affect mated height.  
CAT-SEAMP-XX-XX.  
Patent Pending.  
Mates with:  
NO. PINS  
PER ROW  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
SEAF  
SEAMI  
11.0  
A
K
TR  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAMI  
–1  
= Tin/Lead  
Alloy  
Solder  
Charge  
–L  
(0,25 µm)  
Gold on  
contact area,  
Matte Tin on  
solder tail  
–A  
= 10 µ"  
= Alignment Pins  
08  
Insulator Material:  
–40, –50  
SEAMI  
=Eight Rows  
Black LCP  
= 85Ω tuned  
Contact Material:  
Copper Alloy  
–K  
= Polyimide film  
Pick & Place Pad  
10  
Operating Temp Range:  
=Ten Rows  
Testing Now!  
No. of positions x  
01 (1,27) .050 + (4,98) .196  
–2  
= Lead-Free  
Solder  
Plating:  
NO. OF  
ROWS  
A
B
TR  
Au or Sn over  
50 µ" (1,27 µm) Ni  
Contact  
–S  
=Tape & Reel  
(13,41) (5,08)  
.528 .200  
Charge  
= 30 µ"  
–08  
–10  
Resistance:  
(0,76 µm)  
Gold on  
contact area,  
Matte Tin on  
solder tail  
(15,95) (7,62)  
.628 .300  
Testing Now!  
A
B
Working Voltage:  
Testing Now!  
MATED HEIGHTS*  
RoHS Compliant: Yes  
Lead-Free Solderable: Yes  
SEAMI SEAF LEAD STYLE  
LEAD  
08  
–05.0 –06.0 –06.5  
STYLE  
ALSO AVAILABLE  
16 mm 17 mm 17.5 mm  
(MOQ Required)  
–11.0  
*Processing conditions will  
affect mated height.  
• Other plating options  
• 20 & 30 pins per row  
• 04 & 06 rows  
(14,66)  
.577  
SEAMI/SEAF  
16 mm Stack Height  
Rated @ 3dB Insertion Loss*  
Contact Samtec.  
Single-Ended Signaling  
Differential Pair Signaling  
14 GHz / 28 Gbps  
16.5 GHz / 33 Gbps  
*Test board losses de-embedded from performance data.  
(1,27) .050  
No. of positions x  
(1,27) .050 + (3,58) .141  
(0,86)  
.034  
(1,12)  
.044  
DIA  
Note: Patented  
Complete test data available at www.samtec.com?SEAMI  
or contact sig@samtec.com  
Note: Some sizes, styles and  
options are non-standard,  
non-returnable.  
WWW.SAMTEC.COM  
Due to technical progress, all designs, specifications and components are subject to change without notice.  

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