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Datasheet > SEAMP-20-02.0-L-06
SEAMP-20-02.0-L-06 PDF预览

SEAMP-20-02.0-L-06

更新时间： 2024-11-04 19:17:47
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 1024K
描述
Board Connector, 120 Contact(s), 6 Row(s), Male, Straight, Press Fit Terminal, ROHS COMPLIANT

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SEAMP-20-02.0-L-06 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantFactory Lead Time：2 weeks
风险等级：5.77其他特性：SEARRAY
连接器类型：BOARD CONNECTOR联系完成配合：GOLD (10) OVER NICKEL (50)
联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier触点性别：MALE
触点材料：COPPER ALLOYDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e3MIL 符合性：NO
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
装载的行数：6选件：GENERAL PURPOSE
端子节距：1.27 mm端接类型：PRESS FIT
触点总数：120Base Number Matches：1

SEAMP-20-02.0-L-06 数据手册

  
SEAMP–20–02.0–L–06  
F-213-1  
Press fit  
tails  
(1,27 mm) .050"  
SEAMP, SEAMI SERIES  
SEAMI–50–11.0–L–10–2–A–K–TR  
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD  
Mates with:  
NO. OF POSITIONS  
PER ROW  
PLATING  
OPTION  
NO. OF  
ROWS  
SEAF, SEAF-RA-GP  
OPTION  
SEAMP  
02.0  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAMP  
–L  
–GP  
=Guide  
Post  
(Mates with  
SEAF-RA-  
GP only)  
–04  
= 10µ" (0,25 µm)  
Gold on contact area,  
Matte Tin on tail  
=Four Rows  
Insulator Material:  
Natural LCP  
Contact Material:  
Copper Alloy  
SEAMP  
–10, –20, –30, –40  
= Press Fit  
–06  
No. of positions x  
(1,27) .050 + (5,18) .204  
=Six Rows  
CURRENT RATING  
(PER CONTACT)  
NO. OF  
A
Operating Temp Range:  
-55°C to +125°C  
Plating:  
B
ROWS  
AMBIENT  
–08  
(7,06) (2,54)  
.278 .100  
SEAMP/SEAF  
–04  
–06  
–08  
–10  
–TR  
=Tape  
& Reel  
TEMP  
20°C  
40°C  
60°C  
95°C  
=Eight Rows  
Au or Sn over  
A
2.5A  
2.2A  
1.9A  
1.3A  
50µ" (1,27 µm) Ni  
Contact Resistance:  
8.7 mΩ  
B
(9,60) (2,54)  
.378 .100  
–10  
(12,14) (5,08)  
.478 .200  
(14,68) (7,62)  
.578 .300  
=Ten Rows  
Working Voltage:  
215 VAC  
(1,27) .050  
24 ADJACENT  
POSITIONS POWERED  
RoHS Compliant: Yes  
Processing:  
SEAMP/SEAF-RA  
Rated @ 3dB Insertion Loss*  
11 GHz / 22 Gbps  
(4,60)  
.181  
MATED HEIGHTS*  
Application tooling and one  
ton minimum press required.  
Contact ATG@samtec.com  
for more information.  
Single-Ended Signaling  
Differential Pair Signaling  
*Test board losses de-embedded from performance data.  
SEAMPSEAF LEAD STYLE  
LEAD  
11 GHz / 22 Gbps  
–05.0 –06.0 –06.5  
STYLE  
7 mm 8 mm 8.5 mm  
*Processing conditions will  
affect mated height.  
(0,59) .023  
–02.0  
(1,23)  
.048  
(1,78)  
.070  
Complete test data available at www.samtec.com?SEAMP  
or contact sig@samtec.com  
No. of positions x  
(1,27) .050 - (1,27) .050  
Note: Compliant pin fixture  
CAT-SEAMP-XX-XX.  
Patent Pending.  
Mates with:  
NO. PINS  
PER ROW  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
SEAF  
SEAMI  
11.0  
A
K
TR  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAMI  
–1  
= Tin/Lead  
Alloy  
Solder  
Charge  
–A  
–40,  
–50  
–L  
= Alignment Pins  
–08  
Insulator Material:  
Black LCP  
= 10µ" (0,25 µm)  
Gold on contact area,  
Matte Tin on solder tail  
SEAMI  
=Eight Rows  
= 85Ω tuned  
Contact Material:  
Copper Alloy  
–K  
= Polyimide film  
Pick & Place Pad  
–10  
Operating Temp Range:  
Testing Now!  
=Ten Rows  
No. of positions x (1,27) .050 + (4,98) .196  
01  
–2  
= Lead-Free  
Solder  
Plating:  
Au or Sn over  
–TR  
50µ" (1,27 µm) Ni  
=Tape & Reel  
MATED HEIGHTS*  
Charge  
Contact  
SEAMI SEAF LEAD STYLE  
LEAD  
Resistance:  
Testing Now!  
Working Voltage:  
Testing Now!  
RoHS Compliant:  
Yes  
A
B
–05.0 –06.0 –06.5  
STYLE  
NO. OF  
ROWS  
A
B
16 mm 17 mm 17.5 mm  
–11.0  
*Processing conditions will affect  
mated height.  
(13,41) (5,08)  
.528 .200  
–08  
–10  
08  
Lead-Free  
Solderable:  
Yes  
(15,95) (7,62)  
.628 .300  
ALSO  
AVAILABLE  
(14,66)  
.577  
SEAMI/SEAF  
16 mm Stack Height  
• Other plating options  
• 20 & 30 pins per row  
• 04 & 06 rows  
Rated @ 3dB Insertion Loss*  
Single-Ended Signaling  
Differential Pair Signaling  
*Test board losses de-embedded from performance data.  
14 GHz / 28 Gbps  
16.5 GHz / 33 Gbps  
Call Samtec.  
(1,12)  
.044  
DIA  
(0,86)  
.034  
(1,27) .050  
Complete test data available at www.samtec.com?SEAMI  
or contact sig@samtec.com  
Note: Some sizes, styles and  
options are non-standard,  
non-returnable.  
No. of positions x (1,27) .050 + (3,58) .141  
WWW.SAMTEC.COM  
1

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