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Datasheet > SEAM8-30-S02.0-S-06-2-K
SEAM8-30-S02.0-S-06-2-K PDF预览

SEAM8-30-S02.0-S-06-2-K

更新时间： 2024-11-04 20:52:35
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 1269K
描述
Board Stacking Connector, 180 Contact(s), 6 Row(s), Male, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT

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SEAM8-30-S02.0-S-06-2-K 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantFactory Lead Time：3 weeks 1 day
风险等级：5.77主体宽度：0.248 inch
主体深度：0.179 inch主体长度：1.175 inch
连接器类型：BOARD STACKING CONNECTOR联系完成配合：GOLD (30) OVER NICKEL (50)
联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier触点性别：MALE
触点材料：COPPER ALLOY触点模式：RECTANGULAR
绝缘体颜色：BLACK绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码：e3插接触点节距：0.031 inch
安装选项1：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：6装载的行数：6
最高工作温度：125 °C最低工作温度：-55 °C
PCB接触模式：RECTANGULAR电镀厚度：30u inch
极化密钥：POLARIZED HOUSING额定电流（信号）：1.4 A
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子节距：0.7874 mm端接类型：SURFACE MOUNT
触点总数：180Base Number Matches：1

SEAM8-30-S02.0-S-06-2-K 数据手册

  
F213 (Rev 28AUG13)  
SEAM8–30–S02.0–S–06–2–K  
SEAM8–30–S05.0–S–04–2–K  
(0,80 mm) .0315"  
SEAM8 SERIES  
ULTRA HIGH DENSITY OPEN PIN FIELD  
™
Up to 300 I/Os  
Mates with:  
SEAF8  
SPECIFICATIONS  
4 and 6 row  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAM8  
7 mm and  
10 mm  
Stack  
Insulator Material:  
Black LCP  
Contact Material:  
Copper Alloy  
Heights  
Operating Temp Range:  
-55°C to +125°C  
Plating:  
Au or Sn over  
50µ" (1,27 µm) Ni  
Working Voltage:  
220 VAC  
RoHS Compliant:  
Yes  
Lead-Free Solderable:  
Yes  
Lead-Free  
Solder  
Charge  
®
Terminations  
Signal Integrity  
optimized Edge Rate™  
contact  
PATENT PENDING  
SEAM8/SEAF8  
7 mm Stack Height  
Rated @ 3dB Insertion Loss*  
RECOGNITIONS  
Single-Ended Signaling  
*Test board losses de-embedded from performance data.  
14 GHz / 28 Gbps  
For complete scope  
of recognitions see  
www.samtec.com/quality  
Performance data for other stack heights and complete test data  
available at www.samtec.com?SEAM8 or contact sig@samtec.com  
NO. PINS  
PER ROW  
LEAD  
STYLE  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
SEAM8  
K
–2  
= Lead-Free  
Tin Alloy  
95.5%  
Sn/3.8%  
Ag/0.7%Cu  
Solder  
–K  
–S  
= 30µ"  
(0,76 µm)  
Gold on  
contact  
area,  
Matte Tin  
on solder  
tail  
–04  
=Four  
Rows  
–S02.0  
= 2 mm  
Body Height  
ALSO AVAILABLE  
= Polyimide  
film Pick &  
Place Pad  
(MOQ Required)  
–10, –20,  
–30, –40, –50  
• Other pin counts  
Contact Samtec.  
–06  
=Six  
Rows  
–S05.0  
= 5 mm  
Body Height  
(Standard sizes)  
Charge  
NO. OF  
ROWWSS  
A
(4,30)  
.169  
–04  
–06  
(6,30)  
.248  
No. of positions x  
(0,80) .0315 + (5,84) .230  
06  
MATED HEIGHT*  
LEAD  
SEAF8  
LEAD  
SEAM8 LEAD STYLE  
B
STYLLEE  
(0,75)  
.029  
–S02.0  
–S05.0  
STYLE  
A
(4,50)  
.177  
–S02.0  
–S05.0  
(7,00) .276  
(10,00) .394  
–05.0  
(7,50)  
.295  
*Processing conditions will affect  
mated height.  
01  
(0,70)  
.028  
B
(1,02)  
.040  
(1,10) (1,32)  
(0,80)  
.0315  
(1,32)  
.052 DIA  
x
Note: Patent Pending  
.043 .052  
(1,27)  
.050  
Note: Tape & Reel packaging  
is standard.  
No. of positions x  
(0,80) .0315 + (2,56) .101  
Note: Some sizes, styles and  
options are non-standard,  
non-returnable.  
WWW.SAMTEC.COM  
1

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