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SEAM-50-02.0-S-08-2 PDF预览

SEAM-50-02.0-S-08-2

更新时间： 2024-11-04 08:25:27
品牌 Logo 应用领域
申泰 - SAMTEC 连接器集管和边缘连接器
页数 文件大小 规格书
1页 718K
描述
Board Stacking Connector, 400 Contact(s), 8 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Receptacle, ROHS COMPLIANT

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SEAM-50-02.0-S-08-2 数据手册

  
F-208  
SEAM–20–02.0–S–10–2–A  
SEAM–30–03.5–S–08–2–A  
SEAM–30–02.0–S–08–2–A  
OPEN PIN FIELD ARRAYSEAM SERIES  
Up to  
500 Pins  
(1,27mm) .050" pitch  
Mates with:  
SPECIFICATIONS  
SEAF, SADL  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAM  
Insulator Material:  
®
Low Insertion/  
Extraction Forces  
Black LCP  
Contact Material:  
Copper Alloy  
Current Rating:  
2.7 A  
Operating Temp Range:  
-55°C to +125°C  
Plating:  
APPLICATION  
MATED HEIGHTS*  
SEAF LEAD STYLE  
Au over 50µ" (1,27µm) Ni  
Contact Resistance:  
5.5 mΩ  
–05, –08 and –10 row  
footprint compatible  
with SamArray®.  
SEAM  
LEAD  
–05.0  
–06.0  
–06.5  
STYLE  
Working Voltage:  
240 VAC  
Lead-Free  
Solder  
Charge  
Terminations  
(Tin/Lead also  
available)  
Samples recommended.  
7mm  
8.5mm  
12mm  
14mm  
16mm  
8mm  
9.5mm  
13mm  
15mm  
17mm  
8.5mm  
10mm  
–02.0  
–03.5  
–07.0  
–09.0  
–11.0  
Mated Cycles:  
100  
13.5mm  
15.5mm  
17.5mm  
RoHS Compliant:  
Yes  
7mm Stack Height  
Single-Ended Signaling  
Differential Pair Signaling  
Rated @ -3dB Insertion Loss  
5 GHz / 10 Gbps  
10.5 GHz / 21 Gbps  
Performance data for other stack heights  
available at www.samtec.com?SEAM  
Processing:  
Max Processing Temp:  
230°C for 60 seconds, or  
260°C for 20 seconds 3x  
Lead-Free Solderable:  
Yes  
*Processing conditions will affect  
mated height.  
NO. PINS  
PER ROW  
LEAD  
STYLE  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
OPTION  
SEAM  
Specify  
LEAD  
STYLE  
from  
–S  
= 30µ"  
(0,76µm)  
–04  
=Four  
Rows  
–A  
–2  
= Alignment  
Pins  
= Lead-Free  
Tin Alloy  
–20, –30,  
–40, –50  
Gold on  
(Recommended.  
Arrays will not  
self-center on  
solder pads)  
95.5% Sn/  
3.8% Ag/0.7% Cu  
Solder Charge  
contact area,  
Matte Tin on  
solder tail  
–05  
=Five  
Rows  
chart  
(Lead Style  
–02.0 only)  
DIFFERENTIAL  
APPLICATION  
–K  
= Polyimide  
film  
Pick &  
Place Pad  
–06  
=Six  
Rows  
(Lead Style  
–02.0 only)  
(1,27) .050  
No. of positions x (1,27) .050 + (4,98) .196  
01  
(1,27)  
.050  
No. of  
rows  
x
(1,27)  
.050  
+
(1,98)  
.078  
(1,27)  
.050  
–TR  
=Tape &  
Reel  
–08  
=Eight  
Rows  
PAIR  
ARRAY  
COUNT  
125  
100  
100  
80  
50x10  
50x8  
40x10  
40x8  
08  
–10  
=Ten  
Rows  
(1,02)  
.040  
60  
40x6  
75  
30x10  
30x8  
30x6  
20x10  
20x8  
20x10  
LEAD  
(1,27)  
.050  
A
60  
STYLE  
–02.0  
–03.5  
–07.0  
–09.0  
–11.0  
A
45  
(4,60) .181  
(6,10) .240  
(9,60) .378  
(11,60) .457  
(13,60) .535  
50  
(1,27) .050  
(1,12)  
40  
(0,20)  
.008  
.044 DIA  
25  
No. of positions x (1,27) .050 + (3,58) .141  
Note: Some sizes, styles and  
options are non-standard,  
non-returnable.  
WWW.SAMTEC.COM  
1

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