F-215
SEAM–30–02.0–L–04–2–A–GP–K–TR
SEAM–20–01–L–06–2–RA–GP–TR
(1,27 mm) .050"
SEAM-RA, SEAM-GP SERIES
HI-DENSITY RIGHT ANGLE OPEN PIN FIELD
SEAM-RA Mates with:
NO. PINS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
SEAF, SEAF-RA, SEAFP
OPTION
RA
SEAM
01
TR
SEAM-GP Mates with:
SEAF-RA-GP
–GP
= Guide
Post
SPECIFICATIONS
–1
–04
–TR
=Tape &
Reel
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM-RA
or www.samtec.com?SEAM
–L
= Tin/Lead Alloy
Solder Charge
–20, –30,
= Four Rows
= 10 µ" (0,25 µm)
Gold on contact area,
MatteTin on solder tail
–40, –50
–K
–06
= Polyimide
film Pick &
Place Pad
–2
= Six Rows
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
(19,30) .760
= Lead-Free
Solder Charge
(8,13)
.320
–S
(12,32)
.485
–08*
= 30 µ" (0,76 µm)
= Eight Rows
Gold on contact area,
MatteTin on solder tail
Current Rating:
SEAM-RA = 2.0 A per pin
(6 adjacent pins powered)
OperatingTemp Range:
-55°C to +125°C
Plating:
NO. PINS
PER ROW
–20
A
(7,91)
.312
–10*
(38,94) 1.533
(51,64) 2.033
(64,34) 2.533
(77,04) 3.03
= Ten Rows
–30
–40
–50
* Note: Fixturing required to
(1,60)
.063
(0,64)
.025
process eight and ten row options,
see www.samtec.com/searayfixture
Au or Sn over
50 µ" (1,27 µm) Ni
Contact Resistance:
SEAM-RA = 19 mΩ
SEAM-GP = 5.5 mΩ
Working Voltage:
SEAM-RA = 260 VAC
SEAM-GP = 240 VAC
Mated Cycles:
–GP= No. of positions x (1,27) .050 + (19,56) 0.77
Without –GP= No. of positions x (1,27) .050 + (11,18) 0.44
TEST DATA*
Single-Ended
Differential Pair
SEAM-RA/SEAF-05 SEAM-RA/SEAF-RA
A
23 Gbps
23 Gbps
24 Gbps
22 Gbps
(5,36)
.211
* @ 3dB insertion loss.Test board losses
de-embedded from performance data.
SEAM-GP = 100
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Complete test data available at www.samtec.com?SEAM-RA
or contact sig@samtec.com
(1,27)
.050
(3,05) .120 DIA
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
NO. PINS
PER ROW
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
SEAM
02.0
A GP K TR
–K
film Pick &
= Polyimide
–1
–04
–20, –30,
–L
= Tin/Lead Alloy
Solder Charge
=Four Rows
Place Pad
–40, –50
= 10 µ" (0,25 µm)
Gold on contact area,
MatteTin on solder tail
–06
06
–TR
=Tape & Reel
(Not available
with 50
–2
=Six Rows
= Lead-Free
Solder Charge
–S
–08
(5,54)
.218
= 30 µ" (0,76 µm)
=Eight Rows
positions)
Gold on contact area,
MatteTin on solder tail
–10
01
=Ten Rows
ALSO AVAILABLE
No. of positions x (1,27) .050 + (19,46) .766
(3,05) .120 DIA
(MOQ Required)
*Note: –C Plating passes
(8,13)
• Extended Guide Post
10 year MFG testing
Guide post Field termination kits
(1,27)
.050
.320
•
(12,65)
.498
Note: Some lengths, styles
(4,60)
.181
and options are non-standard, non-
• Other platings
returnable.
Contact Samtec.
Note: SEAM-GP Patented
(0,86)
(1,12) .044 DIA
No. of positions x
(1,27) .050 + (3,58) .141
.034 DIA
(0,51)
.020
SQ
Note: Some sizes, styles and
options are non-standard,
non-returnable.
(1,02)
.040
(1,27)
.050
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.