SPICE MODEL: SDM20U30
SDM20U30
Lead-free Green
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
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Low Forward Voltage Drop
Guard Ring Construction for
Transient Protection
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·
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·
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Negligible Reverse Recovery Time
Low Capacitance
Ultra-Small Surface Mount Package
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device, Note 4 and 5
SOD-523
CATHODE MARK
Dim
A
Min
1.50
1.10
0.25
0.70
0.10
0.55
Max
1.70
1.30
0.35
0.90
0.20
0.65
Qualified to AEC-Q101 Standards for High Reliability
B
C
Mechanical Data
D
MARKING CODE
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Case: SOD-523
E
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
E
G
C
D
G
All Dimensions in mm
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Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
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Marking Code: LM
Ordering Information: See Last Page
Weight: 0.002 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
30
VR(RMS)
IO
V
mA
A
RMS Reverse Voltage
21
200
1.0
Mean Rectifying Current (Note 2)
Peak Forward Surge Current
IFSM
@ 8.3ms Half Sine
Thermal Characteristics
Characteristic
Symbol
Pd
Value
150
Unit
mW
°C/W
°C
Power Dissipation (Note 2)
RqJA
Thermal Resistance, Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range
667
Tj, TSTG
-65 to +125
@ TA = 25°C unless otherwise specified
Electrical Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
Test Conditions
IR = 150mA
V(BR)R
Reverse Breakdown Voltage (Note 3)
30
¾
¾
V
IF = 20mA
IF = 200mA
0.35
0.50
VF
Forward Voltage Drop
¾
¾
V
VR = 30V
150
30
mA
mA
IR
Peak Reverse Current (Note 3)
Total Capacitance
¾
¾
¾
V
R = 10V
VR = 0V, f = 1.0MHz
CT
20
¾
pF
Note:
1. No purposefully added lead.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf. T = 25°C.
A
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30397 Rev. 7 - 2
1 of 3
SDM20U30
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ã Diodes Incorporated