SD3114 Series
Low Profile Power Inductors
Description
RoHS
2002/95/EC
• 125°C maximum total temperature operation
• 3.1mm x 3.1mm x 1.4mm shielded drum core
• Ferrite core material
• Inductance range from 1.0uH to 330uH
• Current range from 2.59 Amps to 0.106 Amps
• Frequency range up to 4MHz
Applications
• Cellular phones, Digital cameras, CD players, PDA’s
• Small LCD displays
• LED driver and LED flash circuits
• Hard disk drives
• Backlighting
• EL panel
Packaging
• Supplied in tape and reel packaging, 4100 per reel
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(range is application specific)
• Solder reflow temperature: +260°C max. for 10 seconds
maximum
Part Number
Rated
Inductance
(µH)
1.0
OCL (1)
(µH)
Part
Irms (2)
Isat (3)
DCR (Ω)
typ. @
20°C
0.058
0.077
0.110
0.167
0.251
0.296
0.329
0.458
0.650
0.821
1.23
1.86
2.62
2.91
3.30
5.07
7.67
11.78
K-factor
(4)
Marking
Amperes
Amperes
Designator
SD3114-1R0-R
SD3114-1R5-R
SD3114-2R2-R
SD3114-3R3-R
SD3114-4R7-R
SD3114-6R8-R
SD3114-8R2-R
SD3114-100-R
SD3114-150-R
SD3114-220-R
SD3114-330-R
SD3114-470-R
SD3114-680-R
SD3114-820-R
SD3114-101-R
SD3114-151-R
SD3114-221-R
SD3114-331-R
1.16+/-30%
1.44+/-30%
2.12+/-30%
3.36+/-30%
4.90+/-30%
6.72+/-30%
8.10+/-30%
10.4+/-30%
14.9+/-20%
22.5+/-20%
33.1+/-20%
47.5+/-20%
68.6+/-20%
81.8+/-20%
101.1+/-20%
149.0+/-20%
220.9+/-20%
329.5+/-20%
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
1.60
1.39
1.17
0.95
0.77
0.71
0.68
0.57
0.48
2.35
2.11
1.74
1.38
1.14
0.98
0.89
0.78
0.66
0.53
0.44
0.37
0.305
0.280
0.252
0.207
0.170
0.139
98
79
67
54
45
37
34
30
25
21
17
14
12
11
10
8
1.5
2.2
3.3
4.7
6.8
8.2
10.0
15.0
22.0
33.0
47.0
68.0
82.0
100.0
150.0
220.0
330.0
0.43
0.35
0.280
0.239
0.227
0.213
0.172
0.140
0.113
6
5
(1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc.
(3) Isat Amperes peak for approximately 30% rolloff (@20°C)
(4) K-factor: Used to determine B p-p for core loss (see graph).
(2) Irms: DC current for an approximate DT of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise. It
is recommended that the temperature of the part not exceed 125°C under worst
case operating conditions verified in the end application.
B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH),
∆I (Peak to peak ripple current in Amps).