SD3110 Series
Low Profile Power Inductors
Description
RoHS
2002/95/EC
• 125°C maximum total temperature operation
• 3.1mm x 3.1mm x 1.0mm shielded drum core
• Ferrite core material
• Inductance range from 0.5uH to 220uH
• Current range from 2.27 Amps to 0.106 Amps
• Frequency range up to 1MHz
Applications
• Cellular phones, Digital cameras, CD players, PDA’s
• Small LCD displays
• LED driver and LED flash circuits
• Hard disk drives
• Backlighting
• EL panel
Packaging
• Supplied in tape and reel packaging, 4100 per reel
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(range is application specific)
• Solder reflow temperature: +260°C max. for 10 seconds
maximum
Part Number
Rated
Inductance
(µH)
0.50
0.82
1.0
OCL (1)
(µH)
Part
Irms (2)
Isat (3)
DCR (Ω)
typ. @
20°C
0.0420
0.0589
0.0683
0.103
0.149
0.195
0.285
0.346
0.432
0.505
0.764
1.13
1.50
2.06
3.13
3.57
4.72
6.16
9.46
K-factor
(4)
Marking
Amperes
Amperes
Designator
SD3110-R50-R
SD3110-R82-R
SD3110-1R0-R
SD3110-1R5-R
SD3110-2R2-R
SD3110-3R3-R
SD3110-4R7-R
SD3110-6R8-R
SD3110-8R2-R
SD3110-100-R
SD3110-150-R
SD3110-220-R
SD3110-330-R
SD3110-470-R
SD3110-680-R
SD3110-820-R
SD3110-101-R
SD3110-151-R
SD3110-221-R
0.44+/-30%
0.82+/-30%
1.05+/-30%
1.60+/-30%
2.27+/-30%
3.48+/-30%
4.96+/-30%
6.70+/-30%
8.01+/-30%
10.18+/-30%
15.32+/-20%
21.49+/-20%
32.72+/-20%
46.29+/-20%
68.04+/-20%
82.65+/-20%
101+/-20%
149+/-20%
219+/-20%
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
1.54
1.30
1.21
0.99
0.82
0.72
0.59
0.54
0.48
0.44
0.36
0.30
0.26
0.22
0.179
0.167
0.146
0.127
0.106
2.27
1.67
1.47
1.19
1.00
0.81
0.68
0.58
0.53
0.47
0.38
0.32
0.26
0.22
0.182
0.166
0.150
0.123
0.120
216
191
169
137
115
93
78
67
61
54
44
37
30
25
21
19
17
14
1.5
2.2
3.3
4.7
6.8
8.2
10.0
15.0
22.0
33.0
47.0
68.0
82.0
100
150
220
12
(1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc.
(3) Isat Amperes peak for approximately 30% rolloff (@20°C)
(4) K-factor: Used to determine B p-p for core loss (see graph).
(2) Irms: DC current for an approximate DT of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise. It
is recommended that the temperature of the part not exceed 125°C under worst
case operating conditions verified in the end application.
B p-p = K*L*∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH),
∆I (Peak to peak ripple current in Amps).