DATA SHEET
SC Series: MIS Chip Capacitors
Features
●
Readily available from stock
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High reliability silicon oxide–nitride dielectric
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Low loss—typically 0.04 dB in a 50 Ω system
Operation through 26 GHz
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Wide temperature operation
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Available lead (Pb)-free, RoHS-compliant, and Green
Electrical Specifications
Capacitance range 0.8 to 1000 pF
Description
:
Skyworks MIS Chip Capacitors are available in a wide range of
sizes and capacitance values. They are frequently used in
applications requiring DC blocking, RF bypassing, or as a fixed
capacitance tuning element in filters, oscillators, and matching
networks. The devices have a dielectric composed of thermally
grown silicon dioxide over which a layer of silicon nitride is
deposited. This dielectric possesses a low temperature coefficient
of capacitance and very high insulation resistance. The devices
also exhibit excellent long-term stability making them suitable for
high-reliability applications. The capacitors have a high dielectric
breakdown which permits the use of thin dielectrics resulting in
large capacitance per unit area. The temperature coefficient is
less that 50 ppm/°C, and operation is suitable from -65 °C to
200 °C. Compared to ceramic capacitors, Skyworks MIS chip
capacitors offer higher Q, and a lower insertion loss of 0.04 dB,
in a 50 Ω system. Insulation resistance is greater than
Temperature coefficient: 50 ppm/°C typical
:
Capacitance tolerance 20%
Operating temperature: -65 °C to +200 °C
Dielectric withstanding voltage: 100 V
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Insulation resistance: 10 megohms typical
Leakage current: typ. < 1 nA
Absolute Maximum Ratings
Characteristic
Value
Operating temperature range (T
)
OP
-65 °C to +200 °C
-65 °C to +200 °C
100 V
Storage temperature range (T
)
STG
Dielectric withstanding voltage
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Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum specifications.
Exceeding any of the absolute maximum/minimum specifications may result in permanent
damage to the device and will void the warranty.
10 M Ω. To accommodate high-volume automated assembly
methods, wafers can be supplied on expanded film frame. To
reduce cost, chips can be supplied packaged in vials with
sample testing only. Packaging in waffle packs with 100%
electrical test and visual inspection is available.
CAUTION: Although this device is designed to be as robust as
possible, ESD (Electrostatic Discharge) can damage
this device. This device must be protected at all times
from ESD. Static charges may easily produce poten-
tials of several kilovolts on the human body or
equipment, which can discharge without detection.
Industry-standard ESD precautions must be employed
at all times.
Skyworks Green products are lead (Pb)-free, RoHS
(Restriction of Hazardous Substances)-compliant,
conform to the EIA/EICTA/JEITA Joint Industry Guide
(JIG) Level A guidelines, and are free from antimony
trioxide and brominated flame retardants.
NEW
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200136 Rev. C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • August 2, 2006
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