Datasheet > SB3020PT_10

SB3020PT_10

更新时间： 2024-10-29 08:53:59

品牌	Logo	应用领域
强茂 - PANJIT		/
页数	文件大小	规格书
2页	48K
描述
SCHOTTKY BARRIER RECTIFIERS

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数据手册

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SB3020PT_10 数据手册

SB3020PT SERIES

SCHOTTKY BARRIER RECTIFIERS

CURRENT

VOLTAGE

20 to 60 Volts

30 Amperes

FEATURES

• Plastic package has Underwriters Laboratory

Flammability Classification 94V-O.

0.640(16.25)

0.620(15.75)

0.199(5.05)

0.175(4.45)

0.142(3.60)

0.125(3.20)

Flame Retardant Epoxy Molding Compound.

• Exceeds environmental standards of

MIL-S-19500/228

• Low power loss, high efficiency.

• Low forward voltage, high current capability

• High surge capacity.

0.095(2.40)

0.087(2.20)

0.070(1.80)

0.126(3.20)

0.110(2.80)

0.050(1.25)

0.045(1.15)

• For use in low voltage,high frequency inverters

free wheeling , and polarlity protection applications.

• In compliance with EU RoHS 2002/95/EC directives

0.030(0.75)

0.017(0.45)

MECHANICAL DATA

0.225(5.70)

0.204(5.20)

• Case: TO-3P Molded plastic

0.225(5.70)

0.204(5.20)

• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026

• Polarity: As marked.

• Standard packaging: Any

• Weight: 0.2245 ounces, 6.3673 grams.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

SB3020PT SB3030PT SB3040PT SB3045PT SB3050PT SB3060PT

PARAMETER

SYMBOL

V_RRM

UNITS

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

V_RMS

31.5

Maximum DC Blocking Voltage

V_DC

Maximum Average Forward Current at Tc =75^OC

I_F(AV)

Peak Forward Surge Current :8.3ms single

half sine-wave superimposed on rated load

(JEDEC method)

I_FSM

V_F

I_R

275

Maximum Forward Voltage at 15A per leg

0.55

0.7

Maximum DC Reverse Current at Rated

DC Blocking Voltage

T_J=25^OC

T_J=100^OC

0.2

Typical Thermal Resistance

R_JC

T_J

1.5

^OC / W

^OC

Operating Junction Temperature Range

Storage Temperature Range

-55 to +125

-55 to +150

T_STG

^OC

NOTE:

Both Bonding and Chip structure are available.

August 30,2010-REV.02

PAGE . 1

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