SAA5297A

更新时间： 2024-01-30 05:06:07

品牌	Logo	应用领域
恩智浦 - NXP		微控制器电视
页数	文件大小	规格书
68页	614K
描述
Economy teletext and TV microcontrollers

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技术参数
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SAA5297A 技术参数

是否Rohs认证：	不符合	生命周期：	Transferred
包装说明：	SDIP, SDIP52,.6	Reach Compliance Code：	unknown
风险等级：	5.8	JESD-30 代码：	R-PDIP-T52
JESD-609代码：	e0	端子数量：	52
最高工作温度：	70 °C	最低工作温度：	-20 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	SDIP
封装等效代码：	SDIP52,.6	封装形状：	RECTANGULAR
封装形式：	IN-LINE, SHRINK PITCH	电源：	5 V
认证状态：	Not Qualified	子类别：	Teletext ICs
表面贴装：	NO	技术：	CMOS
温度等级：	COMMERCIAL	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	THROUGH-HOLE	端子节距：	1.78 mm
端子位置：	DUAL	Base Number Matches：	1

SAA5297A 数据手册

Philips Semiconductors

Preliminary speciﬁcation

Economy teletext and TV microcontrollers

SAA5x9x family

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

18 SOLDERING

18.1 Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary from

50 to 300 seconds depending on heating method. Typical

reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheat for 45 minutes at 45 °C.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

18.3.2 WAVE SOLDERING

Wave soldering is not recommended for QFP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

18.2 SDIP

18.2.1 SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

If wave soldering cannot be avoided, the following

conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves

downstream and at the side corners.

Even with these conditions, do not consider wave

soldering the following packages: QFP52 (SOT379-1),

QFP100 (SOT317-1), QFP100 (SOT317-2),

QFP100 (SOT382-1) or QFP160 (SOT322-1).

18.2.2 REPAIRING SOLDERED JOINTS

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured. Maximum permissible solder

temperature is 260 °C, and maximum duration of package

immersion in solder is 10 seconds, if cooled to less than

150 °C within 6 seconds. Typical dwell time is 4 seconds

at 250 °C.

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

18.3 QFP

18.3.1 REFLOW SOLDERING

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Reflow soldering techniques are suitable for all QFP

packages.

18.3.3 REPAIRING SOLDERED JOINTS

The choice of heating method may be influenced by larger

plastic QFP packages (44 leads, or more). If infrared or

vapour phase heating is used and the large packages are

not absolutely dry (less than 0.1% moisture content by

weight), vaporization of the small amount of moisture in

them can cause cracking of the plastic body. For more

information, refer to the Drypack chapter in our “Quality

Reference Handbook” (order code 9397 750 00192).

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1997 Jul 07

1...63 64 656667 68

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与SAA5297A相关器件

型号	品牌	获取价格	描述	数据表
SAA5297AH	NXP	获取价格	Economy teletext and TV microcontrollers
SAA5297AH/NNN	NXP	获取价格	IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQFP80, 14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, SOT-
SAA5297APS	NXP	获取价格	Economy teletext and TV microcontrollers
SAA5297APS/NNN	NXP	获取价格	IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP52, 0.600 INCH, PLASTIC, SDIP-52, Microcontro
SAA5297H	NXP	获取价格	Economy teletext and TV microcontrollers
SAA5297H/NNN	NXP	获取价格	IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQFP80, Microcontroller
SAA5297PS	NXP	获取价格	Economy teletext and TV microcontrollers
SAA5297PS/NNN	NXP	获取价格	IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP52, 0.600 INCH, PLASTIC, SDIP-52, Microcontro
SAA5351	PHILIPS	获取价格	Display Controller, Bipolar, PDIP40
SAA5355	NXP	获取价格	Single-chip colour CRT controller FTFROM

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