Datasheet > SA50ARLG

SA50ARLG

更新时间： 2024-11-04 12:35:35

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
5页	100K
描述
500 Watt Peak Power MiniMOSORB Zener Transient Voltage Suppressors

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中文翻译

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SA50ARLG 数据手册

SA5.0A Series

500 Watt Peak Power

MiniMOSORBt Zener

Transient Voltage

Suppressors

http://onsemi.com

Unidirectional

The SA5.0A series is designed to protect voltage sensitive

components from high voltage, high energy transients. They have

excellent clamping capability, high surge capability, low zener

impedance and fast response time. The SA5.0A series is supplied in

ON Semiconductor’s exclusive, cost-effective, highly reliable

Surmetict axial leaded package and is ideally-suited for use in

communication systems, numerical controls, process controls,

medical equipment, business machines, power supplies and many

other industrial/consumer applications.

Cathode

Anode

AXIAL LEAD

CASE 59AA

PLASTIC

Features

• Working Peak Reverse Voltage Range − 5.0 to 170 V

• Peak Power − 500 Watts @ 1.0 ms

• ESD Rating of Class 3 (>16 kV) per Human Body Model

• Maximum Clamp Voltage @ Peak Pulse Current

• Low Leakage < 1 mA above 8.5 V

MARKING DIAGRAM

• UL 497B for Isolated Loop Circuit Protection

• Maximum Temperature Coefficient Specified

• Response Time is typically < 1.0 ns

SAxxxA

YYWWG

• Pb−Free Packages are Available*

Mechanical Characteristics:

CASE: Void-free, Transfer-molded, Thermosetting Plastic

FINISH: All external surfaces are corrosion resistant and leads are

readily solderable

MAXIMUM LEAD TEMPERATURE FOR SOLDERING:

260°C, 1/16 in. from the case for 10 seconds

POLARITY: Cathode indicated by polarity band

MOUNTING POSITION: Any

= Assembly Location

SAxxxA = Device Number

(Refer to Table on Page 3)

= Year

= Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

†

Device

SAxxxAG

Package

Shipping

Axial Lead

1000 Units / Box

(Pb−Free)

SAxxxARLG

Axial Lead 5000 / Tape & Reel

(Pb−Free)

SAxxxALFG**

Axial Lead

2000 Units / Box

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

**Lead formed device.

Semiconductor Components Industries, LLC, 2009

Publication Order Number:

October, 2009 − Rev. 13

SA5.0A/D

12 3 4 5

中文翻译

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