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S9S08AW16AE1MLD PDF预览

S9S08AW16AE1MLD

更新时间: 2024-11-07 15:18:11
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
339页 5934K
描述
8-bit MCU, S08 core, 16KB Flash, 40MHz, -40/+125degC, Automotive Qualified, QFP 44

S9S08AW16AE1MLD 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:unknown
风险等级:5.61Base Number Matches:1

S9S08AW16AE1MLD 数据手册

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Document Number: QFN_Addendum  
Rev. 0, 07/2014  
Freescale Semiconductor  
Addendum  
Addendum for New QFN  
Package Migration  
This addendum provides the changes to the 98A case outline numbers for products covered in this book.  
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See  
the table below for the old (gold wire) package versus the new (copper wire) package.  
To view the new drawing, go to Freescale.com and search on the new 98A package number for your  
device.  
For more information about QFN package use, see EB806: Electrical Connection Recommendations for  
the Exposed Pad on QFN and DFN Packages.  
© Freescale Semiconductor, Inc., 2014. All rights reserved.  

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