Datasheet > S71NS256PC0ZJETW3

S71NS256PC0ZJETW3

更新时间： 2024-01-20 09:34:03

品牌	Logo	应用领域
飞索 - SPANSION		/
页数	文件大小	规格书
12页	615K
描述
Memory IC,

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S71NS256PC0ZJETW3 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
包装说明：	,	Reach Compliance Code：	unknown
风险等级：	5.69	Base Number Matches：	1

S71NS256PC0ZJETW3 数据手册

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D a t a S h e e t ( P r e l i m i n a r y )

4.3

Physical Dimensions

Figure 4.3 NLB056—56-ball VFBGA 9.2 x 8.0 mm

0.10

(2X)

J H G F E D C B A

INDEX MARK

PIN A1

CORNER

PIN A1

CORNER

0.10

(2X)

TOP VIEW

BOTTOM VIEW

0.20

0.08

SIDE VIEW

56X

0.15

0.08

NOTES:

1. DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

PACKAGE

JEDEC

NLB 056

N/A

2. ALL DIMENSIONS ARE IN MILLIMETERS.

D x E

9.20 mm x 8.00 mm

PACKAGE

3. BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,

SPP-010.

SYMBOL

MIN

NOM

---

MAX

NOTE

e REPRESENTS THE SOLDER BALL GRID PITCH.

---

1.20

---

PROFILE

5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

0.20

0.85

---

BALL HEIGHT

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

---

0.97

BODY THICKNESS

BODY SIZE

9.20 BSC.

8.00 BSC.

4.50 BSC.

6.50 BSC.

n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

BODY SIZE

MATRIX FOOTPRINT

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

MATRIX SIZE D DIRECTION

MATRIX SIZE E DIRECTION

BALL COUNT

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

Øb

0.25

0.30

0.35

BALL DIAMETER

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

0.50 BSC.

0.50 BSC

BALL PITCH

SD / SE

BALL PITCH

8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

0.25 BSC.

SOLDER BALL PLACEMENT

A2 ~ A13,B1 ~ B14

DEPOPULATED SOLDER BALLS

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

C1,C2,C5,C6,C9,C10,C13,C14

D1,D2,D13,D14,E1,E2,E13,E14,F1,F2,F13,F14

G1,G2,G13,G14,H1,H2,H5,H6,H9,H10,H13,H14

J1 ~ J14, K2 ~ K13

10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.

3507\ 16-038.22 \ 7.14.5

March 30, 2010 S71NS-P_00_07

S71NS-P Memory Subsystem Solutions

1...6 7 8910 11 12

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