是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | TFBGA, BGA56,10X14,20 |
针数: | 56 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.71 |
风险等级: | 5.68 | Is Samacsys: | N |
其他特性: | PSRAM IS ORGANISED AS 128 MB(8 MB X 16-BIT) | JESD-30 代码: | R-PBGA-B56 |
长度: | 9.2 mm | 内存密度: | 536870912 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 16 |
混合内存类型: | FLASH+PSRAM | 功能数量: | 1 |
端子数量: | 56 | 字数: | 33554432 words |
字数代码: | 32000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 32MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装等效代码: | BGA56,10X14,20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
电源: | 1.8 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 子类别: | Other Memory ICs |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
S71NS512RD0ZHEUL0 | CYPRESS | Memory Circuit, 32MX16, CMOS, PBGA56, FBGA-56 |
获取价格 |
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S71NS64JA0BAW110 | SPANSION | Memory Circuit, 4MX16, CMOS, PBGA44, 9.20 X 8 MM, LEAD FREE COMPLIANT, FBGA-44 |
获取价格 |
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S71NS64JA0BAW113 | SPANSION | Memory Circuit, 4MX16, CMOS, PBGA44, 9.20 X 8 MM, LEAD FREE COMPLIANT, FBGA-44 |
获取价格 |
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S71NS64JA0BAW12 | SPANSION | Memory Circuit, 4MX16, CMOS, PBGA44, 9.20 X 8 MM, LEAD FREE COMPLIANT, FBGA-44 |
获取价格 |
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S71NS64JA0BAW13 | SPANSION | Memory Circuit, 4MX16, CMOS, PBGA44, 9.20 X 8 MM, LEAD FREE COMPLIANT, FBGA-44 |
获取价格 |
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S71NS64JA0BAW210 | SPANSION | Memory Circuit, 4MX16, CMOS, PBGA44, 9.20 X 8 MM, LEAD FREE COMPLIANT, FBGA-44 |
获取价格 |